Semiconductors » Test & Measurement (semiconductors)

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Used processing

  • 2003 MOSAID MS-4205

    2003 MOSAID MS-4205

    • Manufacturer: Mosaid

    Process: TEST | Size(mm): 200mm

    Yongin-si, South Korea
  • 1996 Nanometrics Nanospec8000

    1996 Nanometrics Nanospec8000

    • Manufacturer: Nanometrics
    • Model: Nanospec

    5. Wafer Size : Process: MET | Shipping: EXW

    South Korea
  • 2007 KOCUSAI VR120_SD

    2007 KOCUSAI VR120_SD

    • Manufacturer: KOCUSAI

    Wafer size: 12" | Process: Resistivity Test System | Shipping: EXW

    South Korea
  • 2011 HMI eScan 400

    2011 HMI eScan 400

    • Manufacturer: HMI
    • Model: Escan 400

    Wafer size: 12" | Process: E-Beam Defect Inspection | Shipping: EXW

    South Korea
  • 1997 KLA AIT

    1997 KLA AIT

    • Manufacturer: KLA-Tencor
    • Model: AIT

    Wafer size: 8" | Process: MET | Shipping: EXW

    South Korea
  • RUDOLPH AXI935D

    RUDOLPH AXI935D

    • Manufacturer: Rudolph
    • Model: AXI 935

    Wafer size: 12" | Process: AVI | Shipping: EXW`

    South Korea
  • SECRON IP 300

    SECRON IP 300

    • Manufacturer: SECRON

    Wafer size: 12" | Process: Prober | Shipping: EXW`

    South Korea
  • 2004 RUDOLPH AXI-S

    2004 RUDOLPH AXI-S

    • Manufacturer: Rudolph
    • Model: AXI

    Wafer size: 12" | Process: Macro Inspection | Shipping: EXW

    South Korea
  • RUDOLPH AXI-S

    RUDOLPH AXI-S

    • Manufacturer: Rudolph
    • Model: AXI

    Wafer size: 12" | Process: Macro Inspection | Shipping: EXW

    South Korea
  • 2003 RUDOLPH AXI_S

    2003 RUDOLPH AXI_S

    • Manufacturer: Rudolph
    • Model: AXI

    Wafer size: 12" | Process: Defect Inspection | Shipping: EXW`

    South Korea
  • 2007 RUDOLPH RUDOLPH MP1-300

    2007 RUDOLPH RUDOLPH MP1-300

    • Manufacturer: Rudolph
    • Model: MP 300

    Wafer size: 12" | Process: Film thickness measurement | Shipping: EXW

    South Korea
  • 2004 RUDOLPH AXI_S

    2004 RUDOLPH AXI_S

    • Manufacturer: Rudolph
    • Model: AXI

    Wafer size: 12" | Process: Macro Inspection System | Shipping: EXW

    South Korea
  • 2009 RUDOLPH MP300

    2009 RUDOLPH MP300

    • Manufacturer: Rudolph
    • Model: MP 300

    Wafer size: 8" | Process: Film Thickness Measurement | Shipping: EXW

    South Korea
  • 2008 RUDOLPH MP1-300XCU

    2008 RUDOLPH MP1-300XCU

    • Manufacturer: Rudolph
    • Model: MP 300

    Wafer size: 12" | Process: Film Thickness Measurement | Shipping: EXW

    South Korea
  • 2007 RUDOLPH MP300

    2007 RUDOLPH MP300

    • Manufacturer: Rudolph
    • Model: MP 300

    Wafer size: 8" | Process: Film Thickness Measrement | Shipping: EXW

    South Korea
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Overview

Semiconductor inspection and test equipment are specialized machines used to ensure the quality and functionality of semiconductor devices. These machines perform various tests and inspections, including visual inspection, electrical testing, and defect analysis, to identify and address any issues in the semiconductor manufacturing process. They are crucial in maintaining the high standards required in the semiconductor industry.

FAQ

What factors should I consider when buying semiconductor inspection and test equipment?

Consider the equipment's compatibility with your existing systems, the types of tests it performs, its accuracy, and the manufacturer's support and service options. Also, evaluate its overall condition and any included software or accessories.

How can I ensure safe shipping of semiconductor inspection and test equipment?

Use a specialized transport service experienced in handling delicate and high-value equipment. Ensure the equipment is properly packaged, secured, and insured during transit.

What maintenance is required for semiconductor inspection and test equipment?

Regular maintenance includes cleaning, calibration, and software updates. Follow the manufacturer’s guidelines for specific maintenance intervals and procedures to ensure optimal performance and longevity of the equipment.