Tokyo, Japan
2006 Disco DISCO16 DFG8540
- Manufacturer: Disco
- Model: DFG8540
DISCO16 DFG8540 Grinding Tool --> 6/8 Inch Spindle type: Air Bearings | Maximum spindle speed: Max 7,000 RPM | External cooling: Water Cooled | Power requirements: 200-208 V 50/60 Hz 3 Phase
Regensburg, Germany
1995 OKAMOTO VG502-MKII/8
- Manufacturer: Okamoto
- Model: VG-502MKII/8
Process: GRINDER | Size(mm): 150mm
Yongin-si, South Korea
Mechanical spindle wafer grinder
Main purpose of the equipment: Mainly used for thinning and grinding of hard and brittle materials such as sapphires, semiconductors,ceramics, quartz crvstals, and circuit poard packaging ) The equipment adopts a...
Guangzhou, China
SGM-450V
SGM-450V Semiconductor industry, electronic connector industry, ceramic industry, tungsten steel industry, precision and high precision parts processing industry, precision mold industry, etc.
Shenzhen, China
Disco DAG840 Wafer Grinding
- Manufacturer: Disco
- Model: DAG840
Good condition Disco DAG840 Wafer Grinding manufactured in 1996. Located in USA and other countries. Click request price for more information.
Europe
Accretech - Tokyo Seimitsu - TSK PG300RM Wafer Grinding
- Manufacturer: Accretech - Tokyo Seimitsu - TSK
- Model: PG300RM
Good condition Accretech - Tokyo Seimitsu - TSK PG300RM Wafer Grinding manufactured in 2007. Located in South Korea and other countries. Click request price for more information.
South Korea
Disco DFG8540 Wafer Grinding
- Manufacturer: Disco
- Model: DFG8540
Good condition Disco DFG8540 Wafer Grinding available between 2012 and 2014 years. Located in South Korea and other countries. Click request price for more information.
South Korea
Disco DAG810 Wafer Grinding
- Manufacturer: Disco
- Model: DAG810
Good condition Disco DAG810 Wafer Grinding available between 2006 and 2012 years. Located in USA and other countries. Click request price for more information.
Asia
Disco DFG841 Wafer Grinding
- Manufacturer: Disco
- Model: DFG841
Good condition Disco DFG841 Wafer Grinding available between 1994 and 2001 years. Located in USA and other countries. Click request price for more information.
Asia
Okamoto VG-502 Wafer Grinding
- Manufacturer: Okamoto
- Model: VG-502
Good condition Okamoto VG-502 Wafer Grinding manufactured in 1995. Located in USA and other countries. Click request price for more information.
Asia
Disco DFG8560 Wafer Grinding
- Manufacturer: Disco
- Model: DFG8560
Good condition Disco DFG8560 Wafer Grinding manufactured in 2004. Located in USA and other countries. Click request price for more information.
Asia
Disco DFG850 Wafer Grinding
- Manufacturer: Disco
- Model: DFG850
Good condition Disco DFG850 Wafer Grinding manufactured in 2000. Located in USA and other countries. Click request price for more information.
Asia
Accretech - Tokyo Seimitsu - TSK HRG200X Wafer Grinding
- Manufacturer: Accretech - Tokyo Seimitsu - TSK
- Model: HRG200X
Good condition Accretech - Tokyo Seimitsu - TSK HRG200X Wafer Grinding. Located in USA and other countries. Click request price for more information.
Asia
Okamoto KSK-Z2 Wafer Grinding
- Manufacturer: Okamoto
- Model: KSK-Z2
Good condition Okamoto KSK-Z2 Wafer Grinding. Located in Singapore and other countries. Click request price for more information.
Singapore
Okamoto KSK-Z1 Wafer Grinding
- Manufacturer: Okamoto
- Model: KSK-Z1
Good condition Okamoto KSK-Z1 Wafer Grinding. Located in Singapore and other countries. Click request price for more information.
Singapore

