Used Wafer Grinding

TSP-610/810/910/1270/1500 series

This series of polishing machine is a ceramic disk as a carrier, through the paste wax or no wax adsorption way to fix the wafer for polishing of high-precision single-sided polishing equipment, dual-axis, four-a...

TAP-500/600 Dual series

This series of polishing machine is a high precision single-sided polishing equipment with double polishing discs, which can realize four-axis simultaneous processing, and the equipment can be configured accordin...

TMP-200S

This series of equipment is suitable for CMP polishing equipment for thin films (dielectric layers), including oxide, metal, STI, SOI, MEMS and other products of planarization polishing. It adopts multi-partition...

TSP-380

The equipment is desktop high-precision single-side polishing equipment, the equipment occupies a small area, easy to operate, can be matched with copper disk, tin disk, glass disk, stainless steel disk, etc., wi...

TSG-200A

The machine is a double spindle, double table, through the diamond grinding wheel, the resin material will be processed by the creep-feed grinding method, with automatic thickness measurement, multi-stage grindin...

TDP-1200/1204/1500 series

This series of double-sided polishing machine adopts the upper polishing disc can be swung out of the design, airbag pressure way, with different polishing pads, polishing liquid can realize the double-sided poli...

Silicon wafer polishing machine

• Manufacturer: Shin Nippon Koki

Mirror finishing machine for silicon wafers Adoption of originally developed operation system from wafer delivery to polishing and cleaning Target workpiece: Silicon wafer Automatic grinding of silicon ingot circ...

Manual Grinder

Manual grinder: Easy to operate, low energy consumption and Low noise and easy to clean and maintenance.

Okamoto GNX300 Wafer grinder 12" GNX300

• Manufacturer: Okamoto
• Model: GNX-300

Air spindle semi automatic wafer grinder

□ Semi automatic single axis wafer back thinning □ Grindable wafer size 4-8 " □ Single axis single disc mode □ Online thickness measurement □ Corresponding to irregular specifications MDXZ-G300HG □ Semi automatic...

Air spindle full automatic wafer grinder

□ Fully automatic wafer back thinning □ Grindable wafer size4 “/5”/6”/8” □ Two axis three disc mode □ Online thickness measurement □ Wafer cleaning and drying □ Dry in,dry out standard 2 air spindle + 3 mechanica...

Peter Wolters AC-1500P, DSP(Double Sided Polisher)

• Manufacturer: Peter Wolters

Model: AC-1500P Maker: Peter Wolters Vintage: 2007 Condition: Working Wafer size:300mm

2004 DISCO DFG 850

• Manufacturer: Disco
• Model: DFG850

The Disco dfg850 8" back wafer grinding and thinning machine, compatible with 4-5-6" products. high efficiency.

DFG8560

• Manufacturer: SSMC

Conform to the development trend of wafer technology, realize ultra-thin and large caliber wafer processing Gather the essence of existing grinding machine Dfg8540 / 8560 is an upgrade model of dfg800 series with...

DISCO GNX300

• Manufacturer: Disco

Okamoto gnx300 12 inch wafer back ultra-thin grinding and thinning equipment, with new color and high precision in 2005. The company has a professional service team to provide after-sales machine spare parts main...

Accretech - Tokyo Seimitsu - TSK PG200 Wafer Grinding

• Manufacturer: Accretech - Tokyo Seimitsu - TSK
• Model: PG200

Good condition Accretech - Tokyo Seimitsu - TSK PG200 Wafer Grinding. Located in Ireland and other countries. Click request price for more information.