Used Wafer Grinding

Grinding wheel dimensions 575mm x 80mm x 304mm

Grinding wheel - Dimensions: 575mm x 80mm x 304mm, unused, 100% functional, scope of delivery according to photos

Hermes CGR 100/1 JOT8 V40A XZ grinding wheel 40285333

• Manufacturer: Hermes

Hermes CGR 100/1 JOT8 V40A XZ grinding wheel 40285333 / 2868003 permissible speed: 2670 / 63 m/s - dimensions 450mm x 101mm x 203.2mm, unused, 100% functional, scope of delivery according to photos

Grinding wheel dimensions 575mm x 80mm x 305mm

Grinding wheel - Dimensions: 575mm x 80mm x 305mm, unused, 100% functional, scope of delivery according to photos

Tyrolit CSS Ultra CS64A 802 I I 5 VB1 Grinding wheel 681437

• Manufacturer: Disco

Tyrolit CSS-Ultra CS64A 802 I I 5 VB1 grinding wheel 681437 - maximum working speed: 50m/s / speed: 1270/min - dimensions: 750mm x 14mm x 304.8mm, unused in opened original packaging, 100% functional, scope of de...

Tyrolit GA 120/130 M8 BA3 Grinding wheel max. 45 m/s

• Manufacturer: Disco

Tyrolit GA 120/130 M8 BA3 grinding wheel - max. 45 m/s - outer diameter: 600mm height: 85mm inner diameter: 300.5mm, unused in opened original packaging, 100% functional, scope of delivery according to photos ATT...

3 190 029 01 Grinding wheel dimensions 590mm x 80mm x 304mm

3-190-029 01 Grinding wheel - Dimensions: 590mm x 80mm x 304mm / with traces of storage, unused, 100% functional, scope of delivery as per photos

Tyrolit grinding wheel 34276654 / 1174801

• Manufacturer: Tyrolit

Tyrolit grinding wheel 34276654 / 1174801 - Dimension 450 x 50 x 203,2 - C 320 H 8A V18 A - UPM2670, Speed: 2670 / min, unused in opened original packaging, 100% functional, scope of delivery according to photos

Tyrolit CRA120 BR63 Grinding wheels rpm 1900/min

• Manufacturer: Tyrolit

Tyrolit CRA120-BR63 grinding wheel set - rpm 1900/min - 4 pieces 250 x 42 x 127 / 2 x FA 1463388, 1 x FA 1685567, 1 x FA 1661446, unused in opened original packaging, 100% functional, scope of delivery as per photos

IVG-2035/3035

Semi-automatic dual-axis thinning machine is suitable for 2-12 inches wafers and special specifications of the material grinding, manual loading mode, easy to operate, feature-rich, single-axis and dual-axis proc...

IVG-2040/3040

Fully automatic single-axis thinning machine is suitable for 4-12 inches wafer grinding, equipped with robot up and down, and integrated with automatic centering, cleaning and drying functions, equipped with auto...

TFG-2200/3200 series

This equipment is a dual spindle three-station automatic thinning machine for 6/8-inch wafer grinding, with high-precision spindles, equipped with robotic loading and unloading, integrated with automatic centerin...

TFG-3250

This equipment is a 3-spindle, 4-station automatic thinning machine for 6/8-inch wafer grinding, with high-precision spindles, equipped with robotic loading and unloading, integrated with auto-centering, transfer...

TDL-600/1200

This series of double-sided grinding machine is a high-precision, high-stability grinding and processing equipment, with the upper disc, lower disc, inner ring active drive, can be customized according to custome...

IVG-2020/3020

Semi-automatic single-axis thinning machine is suitable for 2-12 inches wafers and special specification material grinding, manual loading mode, simple operation, rich features, configuration of automatic thickne...

TAP-400/450/500/600 series

This series of polishing machine is a double-axis high-precision single-sided polishing equipment, equipment can be configured according to different wafers with the corresponding polishing head, vacuum adsorptio...

Okamoto VG-502MKII/8 Wafer Grinding

• Manufacturer: Okamoto
• Model: VG-502MKII/8

Good condition Okamoto VG-502MKII/8 Wafer Grinding manufactured in 1995. Located in Ireland and other countries. Click request price for more information.