Used Wafer Slicing / Dicing in South Korea

Disco DFD-3D/8

• Manufacturer: Disco
• Model: DFD3D/8

Application: Dicing/Cutting/Slotting various wafers | Drive method: AC Servo Motor-Direct Drive | Minimum stroke: 652mm (25.7") (end to end) | Set-up cut stroke: 200mm (8.7") | Cut speed: 0.7~3000mm/sec (0.0028 ...

Disco DAD-2H/6T

• Manufacturer: Disco
• Model: DAD2H/6T

Application: Dicing/Cutting/Slotting various wafers | ◆ workpiece size: ø160.4 | X-axis: stroke | Cut speed: 0.04 300.0 | Guide and driving method: Air guide,DC servomotor drive,belt feed | Y-axis: Useable strok...

DISCO DFD641

• Manufacturer: Disco
• Model: DFD641

Application: Dicing/Cutting/Slotting various wafers | Models: 6"-compatible automatic dicing saw | Max. work size: ø 203.2 | X-axis: Cutting range (mm) | Max cutting speed (mm/s): 0.1 - 450 | Y-axis: Cutting ran...

Disco DFD 2D/8

• Manufacturer: Disco
• Model: DFD2D/8

Application: Dicing/Cutting/Slotting various wafers | Classification: item | Work size: 200 x 200 | X-axis: Useable stroke | Cut speed: 0.13 to 300 | Y-axis: Useable stroke | Indexing step: 0.0002 | Position acc...

Disco DFD-2S/8

• Manufacturer: Disco
• Model: DFD2S/8

Application: Dicing/Cutting/Slotting various wafers | Drive method: AC Direct Drive | Stroke: 650mm Max | Effective cut stroke: 220mm | Cut speed: 0.7~3000mm/sec | Max programmable stroke: 220mm | Index speed: 3...

Disco DAD561

• Manufacturer: Disco
• Model: DAD561

Application: Dicing for 6 inch | Classification: item | Work size: ø152.4 | X-axis: Useable stroke | Cut speed: 0.04~300.00 | Bearing type: Linear guide | Y-axis: Useable stroke | Indexing step range: 0.0001 to ...

DYNATEX INTERNATIONALTM DX-III

• Manufacturer: Dynatex
• Model: DX-III

Application: Scribing | Automatic: Capable of complete, automatic scribing and breaking of many substrate materials | Cost effective: - System integration allows easy hook-up and transport - Superior yield and i...

2009 Disco+Towa 6340 and Towa SBS9000

• Manufacturer: Towa

Package saw

Disco Hi-Tec America, Inc. DFD6361HC/FC/ET

• Manufacturer: Disco
• Model: DFD6361

Fully automatd 300mm DICING w/HC/FC/ET

DISCO DFD651

• Manufacturer: Disco
• Model: DFD651

Fully Automatic Dicing Saw, 60K RPM, 200V 50/60Hz

2010 安永yasunaga TW-320C 2 Sets

• Manufacturer: 安永yasunaga

Solar battery wire saw

DISCO HI-TEC AMERICA, INC. DFD6361HC/FC/ET

• Manufacturer: Disco
• Model: DFD6361

Fully automatd 300mm DICING w/HC/FC/ET

1995 Sumitomo KC-200A

• Manufacturer: Sumitomo

Wafer size: 8

SEZ Group 304

• Manufacturer: SEZ Group

Wafer size: 12"

Disco Full Automatic Dual Spindles DFD 2D/8

• Manufacturer: Disco
• Model: DFD2D/8

Disco DFD651 Wafer Slicing / Dicing

• Manufacturer: Disco
• Model: DFD651

Good condition Disco DFD651 Wafer Slicing / Dicings available between 1996 and 2005 years. Located in South Korea and other countries. Click request price for more information.