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Used Wafer Slicing / Dicing

  • BG9-1221-000 AS, IL, ML PCB

    BG9-1221-000 AS, IL, ML PCB ASSY

      Information: BG9-1221-000 AS, IL, ML PCB ASSY See the items below and ask us for availability. DESCRIPTION QTY CANON STEPPER LENS AND HOUSING ASSEMBLY 1 Canon MPA 600FA - Mirror Projection Aligner 1 CANON ROTARY ...

      $315 USD
      Santa Barbara, CA
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      Esec 8003

      • Manufacturer: ESEC
      • Model: 8003

      The Esec 8003 Dicing Saw (wafersaw) is a precision machine used to cut semiconductor wafers into individual chips or dice. Wafers are held to the chuck table by means of vacuum and the chuck can accommodate circu...

      Billerica, MA
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      DISCO MICROSCOPE

      • Manufacturer: Disco

      BINOCULAR, FOR DISCO DICING SAW

      Billerica, MA
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      MICROAUTOMATION 602M

      • Manufacturer: Micro Automation

      4″ AIR BEARING DICING SAW, MICROPROCESSOR CONTROLLED

      Billerica, MA
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      MICROAUTOMATION 1006A

      • Manufacturer: Micro Automation

      6″” DICING SAW, AVAILABLE WITH MICROSCOPE OR VIDEO CAMERA.

      Billerica, MA
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      K&S 775-4

      • Manufacturer: Kulicke & Soffa

      6″ COMPUTER CONTROLLED HIGH POWER DICING SAW, W/VIDEO MANGETIC CHUCK, CAN BE CONVERTED TO VAC CHUCK

      Billerica, MA
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      DYNATEX Z740

      • Manufacturer: Dynatex

      LUBRICANT INJECTOR FOR WAFER SAW

      Billerica, MA
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      Disco DAD 522

      • Manufacturer: Disco
      • Model: DAD522

      Wafer size: 200mm

      Grapevine, TX
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      1997 Disco DFD651 Fully Automatic

      1997 Disco DFD651 Fully Automatic Dicing Saw

      • Manufacturer: Disco
      • Model: DFD651

      Very good condition Came from a lab in Japan Low hours

      ASIA
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      Disco DFD-651 Dicing Saw

      • Manufacturer: Disco
      • Model: DFD651

      200mm As-is

      United States
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      Disco DFD651 Fully Automatic Dicing Saw

      • Manufacturer: Disco
      • Model: DFD651

      United States
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      2009 Disco DFL 7160

      2009 Disco DFL 7160

      • Manufacturer: Disco
      • Model: DFL7160

      Process Laser saw Vintage 2009 Wafer Size 8 inch ( Max Workpiece Size 12 inch) Voltage 200~240 VAC ± 10%, 3 Phase Equipment component Main body Main power Loadlock Laser type:A type No Chiller

      ASIA
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      2012 Disco DAD 3240

      2012 Disco DAD 3240

      • Manufacturer: Disco
      • Model: DAD3240

      Vintage 2012 CE Marked NCS: Yes BBD: Yes 6 or 8 inch chuck available

      ASIA
    • Trusted Seller
      Disco DFD6361 wafer dicing saw

      Disco DFD6361 wafer dicing saw 300mm

      • Manufacturer: Disco
      • Model: DFD6361

      Disco DFD6361 Wafer Dicing Saw Configuration: Touch Screen Display with GUI interface Standard 1.2 kW Spindles x2 Automatic Wheel Covers and Sensors Dual Cameras for simultaneous Z1/Z2 kerf check plus Hi-Lo Mag A...

      Bree, Ireland
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      1996 Nitto DR-8500 II

      • Manufacturer: Nitto

      1996 Nitto DR-8500 II Taper

      United States
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      SÜSS MicroTec RA120M Wafer Slicing / Dicing

      • Manufacturer: SÜSS MicroTec
      • Model: RA120M

      Good condition SÜSS MicroTec RA120M Wafer Slicing / Dicings. Located in USA and other countries. Click request price for more information.

      USA
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