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Used ESEC Wafer Slicing / Dicing

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    Esec 8003

    • used

    • Manufacturer: ESEC
    • Model: 8003

    The Esec 8003 Dicing Saw (wafersaw) is a precision machine used to cut semiconductor wafers into individual chips or dice. Wafers are held to the chuck table by means of vacuum and the chuck can accommodate circu...

    Billerica, MA
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    ESEC 8003 Wafer Slicing / Dicing

    • used

    • Manufacturer: ESEC
    • Model: 8003

    Good condition ESEC 8003 Wafer Slicing / Dicings. Located in USA and other countries. Click request price for more information.

    USA