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Used Defect Inspection in Gyeonggi-do, South Korea

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    1998 HITACHI S-4700[W/EDAX]

    • Manufacturer: Hitachi
    • Model: S-4700

    Yongin-si, South Korea
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    1999 HITACHI S-5000

    • Manufacturer: Hitachi
    • Model: S-5000

    Wafer size: 8

    Yongin-si, South Korea
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    1994 HITACHI S-5000

    • Manufacturer: Hitachi
    • Model: S-5000

    Wafer size: 8

    Yongin-si, South Korea
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    2012 HITACHI S-5500

    • Manufacturer: Hitachi
    • Model: S-5500

    Yongin-si, South Korea
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    Hitachi S-4800

    • Manufacturer: Hitachi
    • Model: S-4800

    type II, 5 axis motorized stg, Dig Imaging

    Yongin-si, South Korea
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    Hitachi S-4500

    • Manufacturer: Hitachi
    • Model: S-4500

    type II, 5 axis motorized stg, Dig Imaging, EDS, SE, MCP BSE

    Yongin-si, South Korea
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    Hitachi S-5000H

    • Manufacturer: Hitachi
    • Model: S-5000H

    Ultra High Res, SE, upto 800kx, 20mm X 6mm substrate size

    Yongin-si, South Korea
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    2003 Hitachi High-Technologies S-5200

    • Manufacturer: Hitachi
    • Model: S-5200

    Lead time: Immediatley

    Yongin-si, South Korea
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    HITACHI S-4160

    • Manufacturer: Hitachi
    • Model: S-4160

    Wafer size: 8"

    Yongin-si, South Korea
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    HITACHI S-5000

    • Manufacturer: Hitachi
    • Model: S-5000

    Wafer size: 8"

    Yongin-si, South Korea
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    HITACHI S-5000

    • Manufacturer: Hitachi
    • Model: S-5000

    Wafer size: 8"

    Yongin-si, South Korea
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    2005 Hitachi IS2700

    • Manufacturer: Hitachi
    • Model: IS-2700

    Wafer size: 12

    Yongin-si, South Korea
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    2007 Hitachi RS3000T

    • Manufacturer: Hitachi
    • Model: RS-3000T

    Wafer size: 12

    Yongin-si, South Korea
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    2001 Hitachi S-5200

    • Manufacturer: Hitachi
    • Model: S-5200

    Yongin-si, South Korea
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    HITACHI S-5000

    • Manufacturer: Hitachi
    • Model: S-5000

    Wafer size: 6,8

    Yongin-si, South Korea
23456

Overview

Defect inspection in semiconductor metrology covers systems and processes used to detect, classify, and quantify defects on wafers, masks, and packaged devices. These tools—optical, e-beam, or surface-scatter based—measure defect size, density and location to improve yield and root-cause analysis. Equipment must meet cleanroom, vibration and ESD requirements and often integrates advanced imaging, classification software, and data analytics for production monitoring and process control.

FAQ

What should I check when buying a used defect inspection system?

Verify detector and optics condition, resolution and sensitivity specs, compatible wafer sizes, software/firmware versions, maintenance and calibration history, availability of spare parts and service contracts, and any upgrades needed for your process node.

How should a defect inspection tool be shipped to protect it?

Use climate-controlled, vibration-damped transport with custom crating, secure ESD protection, and shock monitors. Coordinate disassembly and reassembly with the vendor or certified service team and insure the shipment for high-value equipment.

What maintenance and calibration routines are required?

Perform daily optics and cleanliness checks, monitor vacuum/pumps if applicable, and run regular software backups. Schedule annual OEM or qualified-lab calibration, replace consumables per manufacturer intervals, and keep service records to ensure traceable performance.