Defect inspection in semiconductor metrology covers systems and processes used to detect, classify, and quantify defects on wafers, masks, and packaged devices. These tools—optical, e-beam, or surface-scatter based—measure defect size, density and location to improve yield and root-cause analysis. Equipment must meet cleanroom, vibration and ESD requirements and often integrates advanced imaging, classification software, and data analytics for production monitoring and process control.
Verify detector and optics condition, resolution and sensitivity specs, compatible wafer sizes, software/firmware versions, maintenance and calibration history, availability of spare parts and service contracts, and any upgrades needed for your process node.
Use climate-controlled, vibration-damped transport with custom crating, secure ESD protection, and shock monitors. Coordinate disassembly and reassembly with the vendor or certified service team and insure the shipment for high-value equipment.
Perform daily optics and cleanliness checks, monitor vacuum/pumps if applicable, and run regular software backups. Schedule annual OEM or qualified-lab calibration, replace consumables per manufacturer intervals, and keep service records to ensure traceable performance.