- Trusted Seller
2013 DISCO DFL7360
- Manufacturer: Disco
- Model: DFL7360
De-installed, Warehoused, Can be inspected Wafer size: 300MM
Seoul, South Korea - Trusted Seller
Seoul, South Korea - Trusted Seller
2007 ACCRETECH A-WD-300TX
- Manufacturer: Accretech - Tokyo Seimitsu - TSK
- Model: A-WD-300TX
De-installed, Warehoused, Can be inspected Wafer size: 300MM
Seoul, South Korea - Trusted Seller
2004 TSK A-WD-300T
- Manufacturer: Accretech - Tokyo Seimitsu - TSK
- Model: A-WD-300T
De-installed, Warehoused, Can be inspected Wafer size: 300MM
Seoul, South Korea - Trusted Seller
2013 DISCO+SEMES EAD6750
- Manufacturer: Disco
- Model: EAD6750
De-installed, Warehoused, Can be inspected Wafer size: 300MM
Seoul, South Korea - Trusted Seller
2011 TSK ML300PLUS II
- Manufacturer: Accretech - Tokyo Seimitsu - TSK
De-installed, Warehoused, Can be inspected Wafer size: 300MM
Seoul, South Korea - Trusted Seller
Seoul, South Korea 
Disco DAD 521
- Manufacturer: Disco
- Model: DAD521
Application: Dicing/Cutting/Slotting various wafers | Work size: ø152.4 | X-axis: Useable stroke | Cut speed: 0.3~300.0 | Bearing type: Linear guide | Y-axis: Useable stroke | Indexing step: 0.0001 | Position ac...
South Korea
Disco DAD 320
- Manufacturer: Disco
- Model: DAD320
Application: Dicing/Cutting/Slotting various wafers | Classification: item | Work size: 160 x 160 | X-axis: Useable stroke | Cut speed: 0.13 to 300 | Y-axis: Useable stroke | Indexing step: 0.0002 | Position acc...
South Korea
Disco DAD 560
- Manufacturer: Disco
- Model: DAD560
Application: Dicing/Cutting/Slotting various wafers | Classification: item | Work size: ø152.4 | X-axis: Useable stroke | Cut speed: 0.04~300.00 | Bearing type: Linear guide | Y-axis: Useable stroke | Indexing s...
South Korea
ITI EXC-1
- Manufacturer: ITI
Application: Dicing | - height: 61" | - width: 53" + 36" radius for Controller | - depth: 44" | - base weight: 5200 lbs. | - overall weight: 6100 lbs. | - dimensions(wxdxh): 53"x44"x61" | - horse power: 6 hp @ 1...
South Korea
Disco DAD-2H/6T
- Manufacturer: Disco
- Model: DAD2H/6T
Application: Dicing/Cutting/Slotting various wafers | ◆ workpiece size: ø160.4 | X-axis: stroke | Cut speed: 0.04 300.0 | Guide and driving method: Air guide,DC servomotor drive,belt feed | Y-axis: Useable strok...
South Korea
DISCO DFD641
- Manufacturer: Disco
- Model: DFD641
Application: Dicing/Cutting/Slotting various wafers | Models: 6"-compatible automatic dicing saw | Max. work size: ø 203.2 | X-axis: Cutting range (mm) | Max cutting speed (mm/s): 0.1 - 450 | Y-axis: Cutting ran...
South Korea
Disco DFD 2D/8
- Manufacturer: Disco
- Model: DFD2D/8
Application: Dicing/Cutting/Slotting various wafers | Classification: item | Work size: 200 x 200 | X-axis: Useable stroke | Cut speed: 0.13 to 300 | Y-axis: Useable stroke | Indexing step: 0.0002 | Position acc...
South Korea
Disco DFD-2S/8
- Manufacturer: Disco
- Model: DFD2S/8
Application: Dicing/Cutting/Slotting various wafers | Drive method: AC Direct Drive | Stroke: 650mm Max | Effective cut stroke: 220mm | Cut speed: 0.7~3000mm/sec | Max programmable stroke: 220mm | Index speed: 3...
South Korea
Disco DFD6361 Wafer Slicing / Dicing
- Manufacturer: Disco
- Model: DFD6361
Good condition Disco DFD6361 Wafer Slicing / Dicings available between 2004 and 2010 years. Located in USA and other countries. Click request price for more information.
Asia
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