Used Hgtech Machine Tools in Hubei, China

HGTECH MARVEL Series High Laser Power 3kW-12kW
- Manufacturer: Hgtech
Help growing customers to solve the problems of ROI and high equipment maintenance cost.-Meet 100% metal material processing needs -Reduce procurement costs and reduce maintenance costs -One of the mainstream pur...
Wuhan, China
HGTECH SF Series 3D 5-Axis Welding And Cutting
- Manufacturer: Hgtech
Product Description The 3D 5-Axis laser machine series is characterized by high precision, high speed, high efficiency, high stability, leading technology in the world, compact structure, simple operation and eas...
Wuhan, China
HGTECH AUTOBOT Series 3D Five-Axis 1KW-6KW
- Manufacturer: Hgtech
AUTOBOT3015 auto thermal forming parts 3D laser cutting machine is a kind of 3D 5 axis laser manufacture equipment developed specially for auto thermal forming section. It mainly solves the problems of hole cutti...
Wuhan, China
HGTECH Ceramic Substrate Laser Cutting Series Ceramic Substrate Laser Cutting Machine
- Manufacturer: Hgtech
Suitable for laser cutting of alumina, zirconium oxide, aluminum nitride, silicon nitride and other ceramic materials, equipped with loading and unloading mechanism to achieve high efficiency and high precision a...
Wuhan, China
HGTECH Laser Scribing Series Nanosecond Laser Scribing Equipment
- Manufacturer: Hgtech
Product advantages: The cutting line width is narrow (taking ultraviolet dicing as an example: including HAZ ≤ 30 ± 5 μm) , small edge collapse ≤ 10 μm UPH ≥ 15 (take 40mil, 5-inch GPP wafer as an example, includ...
Wuhan, China
HGTECH Wafer Slotting Series Wafer Laser Slotting Equipment
- Manufacturer: Hgtech
Product advantages: Use ultra short pulse processing to reduce edge collapse, delamination and thermal impact, and adopt high-precision visual positioning to ensure the slotting position Based on spatial light mo...
Wuhan, China
HGTECH WALC-F Series WALC High Power 2D Laser Cutting Machine
- Manufacturer: Hgtech
- Cutting thickness: 100 millimeter
WALC-F seriesWALC High Power 2D Laser Cutting Machine The standard WALC-F series high power large format 2D laser cutting machine is a processing equipment used for the large equipment and infrastructure manufact...
Wuhan, China
HGTECH PHOTOVOLTAIC GLASS PUNCHING EQUIPMENT Photovoltaic Laser Processing
- Manufacturer: Hgtech
Adopting an imported picosecond/short pulse width laser, good beam quality, small focus spot, high stability The machine can be equipped with a multi-vibration lens system to reduce the laser processing time The ...
Wuhan, China
HGTECH LCK10G PCB-IC CARRIER BOARD DEFECT IDENTIFICATION
- Manufacturer: Hgtech
Equipment characteristics Equipment characteristicsEquipment characteristics
Wuhan, China
HGTECH GF Series Compact Size Single Platform 1KW-4KW
- Manufacturer: Hgtech
TECHNICAL PARAMETERSTECHNICAL PARAMETERS Models: GF 3015; GF 4022; GF 6025; GF 8025; GF 10025; GF 12025 | Processing area x (mm): 1530; 2230; 2530; 2530; 2530; 2530 | Y: 3050; 4050; 6050; ...
Wuhan, China
HGTECH 3D SR Robot Series Robotic Arm 200w-500w
- Manufacturer: Hgtech
The 3D fiber laser cutting machine of Laserlab has broken the monopoly of foreign markets in automotive industry. This machine mainly processes on parts of 0.5--6 mm thickness and auto three-dimensional parts. It...
Wuhan, China
HGTECH Laser Scribing Series Picosecond Laser Scribing Equipment
- Manufacturer: Hgtech
Product advantages： Cutting line width is narrow (taking ultraviolet collimation as an example, cutting line width + HAZ ≤ 20 ± 5 μ m) Small edge collapse (≤ 10 μ m） UPH ≥ 10 (UV galvanometer: take 3-inch double ...
Wuhan, China
HGTECH WALC-P Series Large Format High-Power Bevel Laser Cutting Machine
- Manufacturer: Hgtech
WALC-P seriesWALC High Power Bevel Laser Cutting Machine The standard WALC-P series high-power bevel laser cutting machine is a general-purpose processing equipment designed for the needs of bevel cutting in cons...
Wuhan, China
HGTECH Defect Detection Series Semiconductor Substrate Defect Detection Equipment
- Manufacturer: Hgtech
Product advantages: Suitable for 4-8 inch wafers, substrates, epitaxial wafers and patterned wafers Detect particles, pits, bumps, scratches, stains, cracks and other defects System resolution: 1-10 μ m No patter...
Wuhan, China
HGTECH U-RIB Series U-RIB Laser Automatic Production Line
- Manufacturer: Hgtech
Product Introduction With the development of bridge technology, U-rib is widely used in the construction of various highways,railroads and bridges with the features of easy construction, uniform force and not eas...
Wuhan, China