HGTECH Defect Detection Series Semiconductor Substrate Defect Detection Equipment in Wuhan, Hubei, China
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Specifications
- Condition
- new
- Item
- Main parameters
- General parameters
- Wafer size; Standard 4 ", 6" (expandable 4 "- 8")
- Number of boxes
- Double-deck, 14 pcs
- Loading and unloading method
- Robot, mapping scanning
- Motion platform
- Y stroke 350mm，repetitive accuracy 10μm Z strooke 8mm，repetitive accuracy 5μm
- Capacity
- 4" , 140WPH 6" , 120WPH
- Detection performance
- Test accuracy; 7 μm
- Camera
- High resolution industrial camera
- Lens
- HD industrial lens
- Light source
- Patented light source
- Environment requirement
- Power supply specification; AC220V， 50Hz
- Air source requirements
- 0 .5-0 .7Mpa compressed air, without obvious water vapor and grease
- Using environment
- Temperature: 15-40 ℃. Humidity requirement: 30% - 70%, no frost
- Overall size
- 1800mm*1300mm*2250mm
- Subcategory
- Specialized products
- Subcategory 2
- Specialized products for semiconductor industry
- Listing ID
- 73915114
Description
Product advantages: Suitable for 4-8 inch wafers, substrates, epitaxial wafers and patterned wafers Detect particles, pits, bumps, scratches, stains, cracks and other defects System resolution: 1-10 μ m No pattern wafer: 180 seconds / wafer when the number of defects is less than 200 Sample display:Sample 1 Sample 2 Sample 3
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