- Trusted Seller

ESEC 2008XP Die Bonder Refurbished
- Manufacturer: ESEC
- Model: 2008 xP
ESEC 2008XP DIE BONDER DINP3, EST5, FPD3, MPD, POST-IQC, PRE-IQC, PVM, WMP Vintage 2001 Refurbished Can Inspect Contact:
Bree, Ireland - Trusted Seller

Esec 2008XP x2set Die Attach
- Manufacturer: ESEC
- Model: 2008 xP
wafer size setup : 8inch package : IC package setup Input : stack leadframe output : magazine Dispensing : PD vintage :2000 location : Asia condition : power up
Trim, Ireland - Trusted Seller
Bree, Ireland - Trusted Seller

2004 ESEC 2008xP
- Manufacturer: ESEC
- Model: 2008 xP
De-installed, Warehoused, Can be inspected Wafer size: 300MM
Seoul, South Korea 
ESEC 2008 xP Die Bonder
- Manufacturer: ESEC
- Model: 2008 xP
Good condition ESEC 2008 xP Die Bonders manufactured in 2008. Located in Ireland and other countries. Click request price for more information.
Ireland

