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Used ESEC 2008 xP Die Bonders

  • Trusted Seller
    ESEC 2008XP Die Bonder Refurbished

    ESEC 2008XP Die Bonder Refurbished

    • Manufacturer: ESEC
    • Model: 2008 xP

    ESEC 2008XP DIE BONDER DINP3, EST5, FPD3, MPD, POST-IQC, PRE-IQC, PVM, WMP Vintage 2001 Refurbished Can Inspect Contact:

    Bree, Ireland
  • Trusted Seller
    Esec 2008XP x2set Die Attach

    Esec 2008XP x2set Die Attach

    • Manufacturer: ESEC
    • Model: 2008 xP

    wafer size setup : 8inch package : IC package setup Input : stack leadframe output : magazine Dispensing : PD vintage :2000 location : Asia condition : power up

    Trim, Ireland
  • Trusted Seller
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    Esec 2008XP x2set

    • Manufacturer: ESEC
    • Model: 2008 xP

    Die Bonder

    Bree, Ireland
  • Trusted Seller
    2004 ESEC 2008xP

    2004 ESEC 2008xP

    • Manufacturer: ESEC
    • Model: 2008 xP

    De-installed, Warehoused, Can be inspected Wafer size: 300MM

    Seoul, South Korea
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    ESEC 2008 xP Die Bonder

    • Manufacturer: ESEC
    • Model: 2008 xP

    Good condition ESEC 2008 xP Die Bonders manufactured in 2008. Located in Ireland and other countries. Click request price for more information.

    Ireland