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Used ESEC 2008 HS3 Plus Die Bonders in Malaysia

  • Trusted Seller
    ESEC 2008HS3 Plus

    ESEC 2008HS3 Plus

    • Manufacturer: ESEC
    • Model: 2008 HS3 Plus

    ESEC 2008HS3 Plus Die Bonder Ex-Works. With wafer handling up to 300mm wafer. Configuration of machine base on customer request.

    Malacca, Malaysia
  • Trusted Seller
    ESEC Smart Card Line

    ESEC Smart Card Line

    • Manufacturer: ESEC
    • Model: 2008 HS3 Plus

    Smart Card line with ESEC DA; Bondztek Inline Oven including Reel handler Die Attach: ESEC 2008HS3 Plus Wire Bonder: ESEC 3100 SC Plus Inline Oven: Bondztek Inline Oven

    Malacca, Malaysia
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    ESEC 2008 HS3 Plus Die Bonder

    • Manufacturer: ESEC
    • Model: 2008 HS3 Plus

    Good condition ESEC 2008 HS3 Plus Die Bonders available between 2003 and 2008 years. Located in Malaysia and other countries. Click request price for more information.

    Malaysia