- Trusted Seller

ESEC 2008 HS3 PLUS
- Manufacturer: ESEC
- Model: 2008 HS3 Plus
ESEC 2008 HS3 PLUS 6 available units 12inch & 8 inch wafer table working condition Vintages 2005-2007 in Warehouse
Bree, Ireland - Trusted Seller

2006 ESEC 2008hS3 plus
- Manufacturer: ESEC
- Model: 2008 HS3 Plus
De-installed, Warehoused, Can be inspected Wafer size: 300MM
Seoul, South Korea - Trusted Seller

ESEC 2008HS3 Plus
- Manufacturer: ESEC
- Model: 2008 HS3 Plus
ESEC 2008HS3 Plus Die Bonder refurbished condition Configuration – 12” wafer table, Writing dispenser, TOS input, Magazine output, wafer map, OBC, PostIQC.
Asia - Trusted Seller

ESEC Smart Card Line
- Manufacturer: ESEC
- Model: 2008 HS3 Plus
Smart Card line with ESEC DA; Bondztek Inline Oven including Reel handler Die Attach: ESEC 2008HS3 Plus Wire Bonder: ESEC 3100 SC Plus Inline Oven: Bondztek Inline Oven
Malacca, Malaysia - Trusted Seller

ESEC 2008HS3 Plus
- Manufacturer: ESEC
- Model: 2008 HS3 Plus
ESEC 2008HS3 Plus Die Bonder Ex-Works. With wafer handling up to 300mm wafer. Configuration of machine base on customer request.
Malacca, Malaysia 
ESEC 2008 HS3 Plus Die Bonder
- Manufacturer: ESEC
- Model: 2008 HS3 Plus
Good condition ESEC 2008 HS3 Plus Die Bonders available between 2003 and 2008 years. Located in Malaysia and other countries. Click request price for more information.
Malaysia

