Used Disco DAD2H/6T Assembly / Packaging (Semiconductors)

Disco Abrasive Systems DAD-2H/6T

• Manufacturer: Disco
• Model: DAD2H/6T

Automatic Dicing Saw, Wafer Abrasive Systems, Spindle Speed: 30,000RPM, Power AC - 200V, 3Phase, 50/60Hz, 3.0KvA, **With SMC Air Regulator (NAR3000 - 7-120psi), Sony Monitor (SSM-930 - #105306)**

Disco DAD-2H/6T

• Manufacturer: Disco
• Model: DAD2H/6T

Application: Dicing/Cutting/Slotting various wafers | ◆ workpiece size: ø160.4 | X-axis: stroke | Cut speed: 0.04 300.0 | Guide and driving method: Air guide,DC servomotor drive,belt feed | Y-axis: Useable strok...

1996 DISCO DAD2H6T

• Manufacturer: Disco
• Model: DAD2H/6T

The Disco dfg840, a classic 8-inch wafer grinding equipment, can be compatible with 4-5-6-inch wafers. The company has a professional after-sales team to provide relevant installation, commissioning and maintenan...

1996 DISCO DAD2H6T

• Manufacturer: Disco
• Model: DAD2H/6T

Disco Semi-Auto DAD 2H/6T

• Manufacturer: Disco
• Model: DAD2H/6T

Disco DAD2H/6T Assembly / Packaging (semiconductors)

• Manufacturer: Disco
• Model: DAD2H/6T

Good condition Disco DAD2H/6T Assembly / Packaging (semiconductors)s manufactured in 1989. Located in Ireland and other countries. Click request price for more information.