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South Korea
Disco DAD381
- Manufacturer: Disco
- Model: DAD381
Application: Dicing for 12 inch | Axis/block: Item | Work size: 304.8 x 304.8 | X-axis: Useable stroke | Cut speed: 0.1 to 400 | Y-axis: Useable stroke | Indexing step: 0.0001 | Position accuracy (cumulative pit...
South Korea
Disco DAD 320
- Manufacturer: Disco
- Model: DAD320
Application: Dicing/Cutting/Slotting various wafers | Classification: item | Work size: 160 x 160 | X-axis: Useable stroke | Cut speed: 0.13 to 300 | Y-axis: Useable stroke | Indexing step: 0.0002 | Position acc...
South Korea
Disco DAD 560
- Manufacturer: Disco
- Model: DAD560
Application: Dicing/Cutting/Slotting various wafers | Classification: item | Work size: ø152.4 | X-axis: Useable stroke | Cut speed: 0.04~300.00 | Bearing type: Linear guide | Y-axis: Useable stroke | Indexing s...
South Korea
Disco DAD 521
- Manufacturer: Disco
- Model: DAD521
Application: Dicing/Cutting/Slotting various wafers | Work size: ø152.4 | X-axis: Useable stroke | Cut speed: 0.3~300.0 | Bearing type: Linear guide | Y-axis: Useable stroke | Indexing step: 0.0001 | Position ac...
South Korea
Disco DAD 640
- Manufacturer: Disco
- Model: DAD640
Application: Dicing/Cutting/Slotting for 8 inch | Work size: 203.2 | X-axis: Useable stroke | Cut speed: 0.1 to 450 | Y-axis: Useable stroke | Indexing step: 0.0002 | Position accuracy (cumulative pitch): 0.002 ...
South Korea
Disco DFD 651
- Manufacturer: Disco
- Model: DFD651
Application: Dicing/Cutting/Slotting various wafers | Maximum compatible wok size: ø 203.2 | Correspondence frame: 2-6, 2-8 | X-axis: Cutting range (mm) | Feed speed input range (mm/s): 0.1 - 450 | Y-axis: Cutti...
South Korea
South Korea
Disco DAD-2H/6T
- Manufacturer: Disco
- Model: DAD2H/6T
Application: Dicing/Cutting/Slotting various wafers | ◆ workpiece size: ø160.4 | X-axis: stroke | Cut speed: 0.04 300.0 | Guide and driving method: Air guide,DC servomotor drive,belt feed | Y-axis: Useable strok...
South Korea
Disco DFD 2D/8
- Manufacturer: Disco
- Model: DFD2D/8
Application: Dicing/Cutting/Slotting various wafers | Classification: item | Work size: 200 x 200 | X-axis: Useable stroke | Cut speed: 0.13 to 300 | Y-axis: Useable stroke | Indexing step: 0.0002 | Position acc...
South Korea
Disco DFD-2S/8
- Manufacturer: Disco
- Model: DFD2S/8
Application: Dicing/Cutting/Slotting various wafers | Drive method: AC Direct Drive | Stroke: 650mm Max | Effective cut stroke: 220mm | Cut speed: 0.7~3000mm/sec | Max programmable stroke: 220mm | Index speed: 3...
South Korea
Disco DFD-3D/8
- Manufacturer: Disco
- Model: DFD3D/8
Application: Dicing/Cutting/Slotting various wafers | Drive method: AC Servo Motor-Direct Drive | Minimum stroke: 652mm (25.7") (end to end) | Set-up cut stroke: 200mm (8.7") | Cut speed: 0.7~3000mm/sec (0.0028 ...
South Korea- Trusted Seller
2013 DISCO+SEMES EAD6750
- Manufacturer: Disco
- Model: EAD6750
De-installed, Warehoused, Can be inspected Wafer size: 300MM
Seoul, South Korea - Trusted Seller
2005 DISCO+HANMI DFD6340+HANMI 3500D
- Manufacturer: Disco
- Model: DFD6340
De-installed, Warehoused, Can be inspected Wafer size: 300MM
Seoul, South Korea 
Yongin-si, South Korea
Disco DFD651 Assembly / Packaging (semiconductors)
- Manufacturer: Disco
- Model: DFD651
Good condition Disco DFD651 Assembly / Packaging (semiconductors)s manufactured in 1997. Located in South Korea and other countries. Click request price for more information.
South Korea