Semiconductors » Wafer Slicing / Dicing

Building Filters

Related Events

Live Now

Lumentum - Surplus Semiconductor Fabrication Tools and Optical Communication Testers from Takao Japan Facility

by AllSurplus

Online
Ends Sep 30th, 0:00 CDT
View event
833

Used Wafer Slicing / Dicing

  • Trusted Seller
    2002 Disco DFD641

    2002 Disco DFD641

    • Manufacturer: Disco
    • Model: DFD641

    With End User Working condition

    Asia
  • Trusted Seller
    2015 TSK AD3000T Dicer

    2015 TSK AD3000T Dicer

    • Manufacturer: Accretech - Tokyo Seimitsu - TSK
    • Model: AD3000T

    working condition

    Asia
  • Trusted Seller
    2011 Disco DAD 3350

    2011 Disco DAD 3350

    • Manufacturer: Disco
    • Model: DAD3350

    Working Condition Vintage : 2011 Complete

    Asia
  • Trusted Seller
    2005 Disco DFD6360

    2005 Disco DFD6360

    • Manufacturer: Disco
    • Model: DFD6360

    Working condition

    Asia
  • Trusted Seller
    2018 Disco DAD 6450

    2018 Disco DAD 6450

    • Manufacturer: Disco
    • Model: DAD6450

    DISCO DAD6450, 2.2kw output, 3 inch spindle, maximum 20000rpm

    Asia
  • Trusted Seller
    Disco DAD3350

    Disco DAD3350

    • Manufacturer: Disco
    • Model: DAD3350

    Asia
  • Trusted Seller
    1999 DISCO DAD341

    1999 DISCO DAD341

    • Manufacturer: Disco
    • Model: DAD341

    Refurbished Condition

    Asia
  • Trusted Seller
    1998 Takatori ATM 1100C

    1998 Takatori ATM 1100C

    • Manufacturer: Takatori

    Asia
  • Disco DAD 521

    Disco DAD 521

    • Manufacturer: Disco
    • Model: DAD521

    Application: Dicing/Cutting/Slotting various wafers | Work size: ø152.4 | X-axis: Useable stroke | Cut speed: 0.3~300.0 | Bearing type: Linear guide | Y-axis: Useable stroke | Indexing step: 0.0001 | Position ac...

    South Korea
  • Disco DAD 320

    Disco DAD 320

    • Manufacturer: Disco
    • Model: DAD320

    Application: Dicing/Cutting/Slotting various wafers | Classification: item | Work size: 160 x 160 | X-axis: Useable stroke | Cut speed: 0.13 to 300 | Y-axis: Useable stroke | Indexing step: 0.0002 | Position acc...

    South Korea
  • Disco DAD 560

    Disco DAD 560

    • Manufacturer: Disco
    • Model: DAD560

    Application: Dicing/Cutting/Slotting various wafers | Classification: item | Work size: ø152.4 | X-axis: Useable stroke | Cut speed: 0.04~300.00 | Bearing type: Linear guide | Y-axis: Useable stroke | Indexing s...

    South Korea
  • Disco DAD-2H/6T

    Disco DAD-2H/6T

    • Manufacturer: Disco
    • Model: DAD2H/6T

    Application: Dicing/Cutting/Slotting various wafers | ◆ workpiece size: ø160.4 | X-axis: stroke | Cut speed: 0.04 300.0 | Guide and driving method: Air guide,DC servomotor drive,belt feed | Y-axis: Useable strok...

    South Korea
  • ITI EXC-1

    ITI EXC-1

    • Manufacturer: ITI

    Application: Dicing | - height: 61" | - width: 53" + 36" radius for Controller | - depth: 44" | - base weight: 5200 lbs. | - overall weight: 6100 lbs. | - dimensions(wxdxh): 53"x44"x61" | - horse power: 6 hp @ 1...

    South Korea
  • DISCO DFD641

    DISCO DFD641

    • Manufacturer: Disco
    • Model: DFD641

    Application: Dicing/Cutting/Slotting various wafers | Models: 6"-compatible automatic dicing saw | Max. work size: ø 203.2 | X-axis: Cutting range (mm) | Max cutting speed (mm/s): 0.1 - 450 | Y-axis: Cutting ran...

    South Korea
  • Disco DFD 2D/8

    Disco DFD 2D/8

    • Manufacturer: Disco
    • Model: DFD2D/8

    Application: Dicing/Cutting/Slotting various wafers | Classification: item | Work size: 200 x 200 | X-axis: Useable stroke | Cut speed: 0.13 to 300 | Y-axis: Useable stroke | Indexing step: 0.0002 | Position acc...

    South Korea
4647484950