Semiconductors » Wafer Slicing / Dicing

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833

Used Wafer Slicing / Dicing

Trusted Seller
Disco #
- Manufacturer: Disco
Disco
Bree, Ireland
Trusted Seller
Intercon Packing Sawing Cutting Machine
- Manufacturer: Unknown
Intercon Packing Sawing Cutting Machine Packing Sawing Cutting Machine
Bree, Ireland
Trusted Seller
Meyer Burger Multi-Wire Saw
- Manufacturer: Meyer
Meyer Burger Multi-Wire Saw Multi-Wire Saw
Bree, Ireland
Trusted Seller
Shanghai Jintai Automatic Cutting Machine
- Manufacturer: Unknown
Shanghai Jintai Automatic Cutting Machine Automatic Cutting Machine
Bree, Ireland
Trusted Seller
Takatori Down Cut Multi Wire Saw
- Manufacturer: Takatori
Takatori Down Cut Multi Wire Saw Down Cut Multi Wire Saw
Bree, Ireland
Trusted Seller
Takatori Multi-Wire Saw
- Manufacturer: Takatori
Takatori Multi-Wire Saw Multi-Wire Saw
Bree, Ireland
Trusted Seller
PST MELITASF20VD 200mm
- Manufacturer: Unknown
PST MELITAS_F20VD 200mm HTO(DCS)
Bree, Ireland
Trusted Seller
Towa Corporation Intercon SBS 8800 Substrate Singulation
- Manufacturer: Towa
Towa Corporation Intercon SBS 8800 Substrate Singulation
Bree, Ireland
Trusted Seller
DISCO DFD-6361
- Manufacturer: Disco
- Model: DFD6361
DISCO DFD-6361 Vintage 31/10/2005
Bree, Ireland
Trusted Seller
KINIK BI2
- Manufacturer: Unknown
KINIK BI2 Main Body,Disk break-in 300 mm Vintage 2006
Bree, Ireland
Trusted Seller
Meyer Burger Wire Saw
- Manufacturer: Meyer
Meyer Burger Wire Saw Wire Saw
Bree, Ireland
Trusted Seller
ESI M9830
- Manufacturer: ESI
ESI M9830
Bree, Ireland
Trusted Seller
TSK A-WD-200T
- Manufacturer: Accretech - Tokyo Seimitsu - TSK
TSK A-WD-200T Dicer
Bree, Ireland
Trusted Seller
BESI MECO MISS 2 INTERPOSER SINGULATION SYSTEM
- Manufacturer: Meco
BESI MECO MISS 2 INTERPOSER SINGULATION SYSTEM package saw 2530 mm × 1600 mm × 2240 mm 8 Systems Available
Trim, Ireland
Trusted Seller
Heraeus HEP 21 burn-in system
- Manufacturer: Heraeus - Hanau - Vötsch
Heraeus HEP 21 burn-in system
Trim, Ireland

4344 45 46 47

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Lumentum - Surplus Semiconductor Fabrication Tools and Optical Communication Testers from Takao Japan Facility

Used Wafer Slicing / Dicing

Disco #

Intercon Packing Sawing Cutting Machine

Meyer Burger Multi-Wire Saw

Shanghai Jintai Automatic Cutting Machine

Takatori Down Cut Multi Wire Saw

Takatori Multi-Wire Saw

PST MELITASF20VD 200mm

Towa Corporation Intercon SBS 8800 Substrate Singulation

DISCO DFD-6361

KINIK BI2

Meyer Burger Wire Saw

ESI M9830

TSK A-WD-200T

BESI MECO MISS 2 INTERPOSER SINGULATION SYSTEM

Heraeus HEP 21 burn-in system

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