Semiconductors » Wafer Slicing / Dicing

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621

Used Wafer Slicing / Dicing

SEZ Group 304
- Manufacturer: SEZ Group
Wafer size: 12"
Yongin-si, South Korea
1995 Sumitomo KC-200A
- Manufacturer: Sumitomo
Wafer size: 8
Yongin-si, South Korea
Trusted Seller
TSK A-WD-10A
- Manufacturer: Accretech - Tokyo Seimitsu - TSK
- Model: A-WD-10A
Asia
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1996 TSK A-WD-5000A
- Manufacturer: Accretech - Tokyo Seimitsu - TSK
- Model: A-WD-5000A
TSKA-WD-5000A working condition
Asia
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TSK A-WD-5000A
- Manufacturer: Accretech - Tokyo Seimitsu - TSK
- Model: A-WD-5000A
Asia
Trusted Seller
TSK A-WD-250S
- Manufacturer: Accretech - Tokyo Seimitsu - TSK
- Model: A-WD-250S
Asia
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TSK A-WD-110A
- Manufacturer: Accretech - Tokyo Seimitsu - TSK
- Model: A-WD-110A
Asia
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DISCO DAD552
- Manufacturer: Disco
Asia
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TSK A-WD-300T
- Manufacturer: Accretech - Tokyo Seimitsu - TSK
- Model: A-WD-300T
Asia
Trusted Seller
TSK A-WD-211T
- Manufacturer: Accretech - Tokyo Seimitsu - TSK
Asia
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TSK A-WD-100M
- Manufacturer: Accretech - Tokyo Seimitsu - TSK
- Model: A-WD-100M
Asia
Trusted Seller
TSK A-WD-100A
- Manufacturer: Accretech - Tokyo Seimitsu - TSK
- Model: A-WD-100A
Asia
K&S 980
- Manufacturer: Kulicke & Soffa
Like New 8″ wafer saw complete with integrated cleaner
Murfreesboro, TN
2017 Meyer Burger DW 288
- Manufacturer: Meyer
- Model: DW 288
Less than 500 hours used on this tool. Spare Parts are also included. - This tool is also available through a lease-to-own option subject to credit approval
$275,000 USD
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Est. $5,176/mo
France
HGTECH LUSD3310 Fully Automatic SiC Wafer Modification and Cutting Equipment
- Manufacturer: Hgtech
The Fully Automatic SiC Wafer Modification and Cutting Equipment LUSD3310 uses multiple high-precision CCD vision cameras to automatically identify and locate 6-8 inch wafers with various die specifications. Comb...
Wuhan, China