Used Wafer Slicing / Dicing

HiKE DD-1206V-DF

• Manufacturer: Unknown

HiKE DD-1206V-DF Nitride 300 mm Vintage 2006

Meyer Burger Multi-Wire Saw

• Manufacturer: Meyer

Meyer Burger Multi-Wire Saw Multi-Wire Saw

ACCRETECH ML200

• Manufacturer: Accretech - Tokyo Seimitsu - TSK
• Model: ML200

ACCRETECH ML200 Dicer/Laser

2007 Tokyo Seimitsu Co SEP200B

• Manufacturer: Accretech - Tokyo Seimitsu - TSK
• Model: SEP200B

8" Separator for stealth laser diced 8" wafer

2012 Tokyo Seimitsu Co SEP300

• Manufacturer: Accretech - Tokyo Seimitsu - TSK
• Model: SEP300

12" Separator for stealth laser diced 12" wafer

2007 ACCRETECH A-WD-300TX

• Manufacturer: Accretech - Tokyo Seimitsu - TSK
• Model: A-WD-300TX

De-installed, Warehoused, Can be inspected Wafer size: 300MM

2004 TSK A-WD-300T

• Manufacturer: Accretech - Tokyo Seimitsu - TSK
• Model: A-WD-300T

De-installed, Warehoused, Can be inspected Wafer size: 300MM

2011 TSK ML300PLUS II

• Manufacturer: Accretech - Tokyo Seimitsu - TSK
• Model: ML300Plus II

De-installed, Warehoused, Can be inspected Wafer size: 300MM

2005 Nitto M286N wafer Mounter

• Manufacturer: Nitto
• Model: M286N

Nitto M286N 2005.10 W524A05

Disco DCS 141 Wafer Cleaner

• Manufacturer: Disco
• Model: DCS 141

Sold in Good working Condition

2010 TSK A-WD-300TX

• Manufacturer: Accretech - Tokyo Seimitsu - TSK
• Model: A-WD-300TX

Running in line Conversion kit included so can be 8" and 12" Size 1,650(W) x 1,420(D) x 1,800(H) mm Weight 1,800 Kg Frame size 8“ & 12” Wafer size Max. 310mm Air pressure 0.55 - 0.7 Mpa Cutting wafer press...

2010 TSK A-WD-300TX

• Manufacturer: Accretech - Tokyo Seimitsu - TSK
• Model: A-WD-300TX

Running in line Conversion kit included so can be 8" and 12" Size: 1,650(W) x 1,420(D) x 1,800(H) mm Weight 1,800 Kg Frame size 8“ & 12” Wafer size: Max. 310mm Air pressure 0.55 - 0.7 Mpa Cutting wafer pre...

2009 TSK A-WD-300TX

• Manufacturer: Accretech - Tokyo Seimitsu - TSK
• Model: A-WD-300TX

Running in line Conversion kit included so can be 8" and 12" SIZE 1,650(W) x 1,420(D) x 1,800(H) mm WEIGHT 1,800 Kg FRAME SIZE 8“ & 12” WAFER SIZE Max. 310mm AIR PRESSURE 0.55 - 0.7 Mpa CUTTING WAFER PRESS...

2017 Nitto DR8500-111

• Manufacturer: Nitto

Sold in good working condition

2000 Nitto HSA840 tape remover

• Manufacturer: Nitto