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Used Wafer Slicing / Dicing in China

HGTECH LUSD3310 Fully Automatic SiC Wafer Modification and Cutting Equipment
- new
- Manufacturer: Hgtech
The Fully Automatic SiC Wafer Modification and Cutting Equipment LUSD3310 uses multiple high-precision CCD vision cameras to automatically identify and locate 6-8 inch wafers with various die specifications. Comb...
Wuhan, China
YBDX160 Diamond Multi-wire Saw
- new
- Manufacturer: Beijing Sinopoly Technology
Model.160 is mainly used for highly speeding and highly precisely slicing 2" , 4" ,6" sapphire ingot in mass prodution. The equipment can achieve a very good stable performance featured with low noise, low vibrat...
Beijing, China
DX485C Multi-wire Saw
- new
- Manufacturer: Beijing Sinopoly Technology
Technique features This cutting machine is effective cutting equipment, which have high accuracy and good features, and can cut piezo quartz, semiconductor monocrystalline that used in the semiconductor and micro...
Beijing, China
DX2231HC Multi-wire Saw
- new
- Manufacturer: Beijing Sinopoly Technology
Technique features This cutting machine is effective cutting equipment, which have high accuracy and good features, and can cut piezo quartz, semiconductor monocrystalline that used in the semiconductor and micro...
Beijing, China
Dicing Machine AD2000T/S
- used
- Manufacturer: SSMC
Achieved smallest footprint possible utilizing our own core technology. Feature1 nWorld's most efficient Dicing Machine Delivering fast X-axis (Up to 1,000mm/sec) and Y-axis (Up to 300mm/sec) processing speed. Lo...
Suzhou, China
ACCRETECH SS30
- used
- Manufacturer: Accretech - Tokyo Seimitsu - TSK
12-inch dicing machine Small footprint with highly stable structure. Compliant with varieties of work Feature1 nFootprint Small footprint with highly stable structure nCompliant with varieties of work ・300mm wafe...
Suzhou, China
ACCRETECH SS20
- used
- Manufacturer: Accretech - Tokyo Seimitsu - TSK
- Model: SS20
8-inch dicing machine Small footprint with highly stable structure. Compliant with the large work Feature1 nFootprint Small footprint with highly stable structure nCompliant with large wafers 250mm square work si...
Suzhou, China
ACCRETECH SS10
- used
- Manufacturer: Accretech - Tokyo Seimitsu - TSK
Fastest and smallest 6-inch dicing machine. Improved operability with the 17-inch touch panel screen. The image-processing engine accommodates variety of work. Feature1 Fastest and smallest 6-inch dicing machine ...
Suzhou, China
1997 DISCO DAD321
- used
- Manufacturer: Disco
- Model: DAD321
The DAD321 dices a workpiece with diameter up to 6 inch using a high-output air spindle with a The DAD321 dices a workpiece with diameter up to 6 inch using a high-output air spindle with a diamond blade attached...
Suzhou, China
ACCRETECH ML200Plus FH
- used
- Manufacturer: Accretech - Tokyo Seimitsu - TSK
8-inch laser dicing machine with dicing frame handling system. We have developed a dicing machine equipped with stealth dicing technology (developed by Hamamatsu Photonics) as a stealth dicing engine, exhibiting ...
Suzhou, China
ACCRETECH AD20T/S
- used
- Manufacturer: Accretech - Tokyo Seimitsu - TSK
Revolutionary axis design orientation creates the smallest twin spindle Dicing Saw Dicing Saw nFoot print The world's smallest footprint Footprint reduced 40% compared with Accretech's existing machines nHigh Thr...
Suzhou, China
2009 DISCO DFD6361
- used
- Manufacturer: Disco
- Model: DFD6361
Enhanced dicing throughput The DFD6361 enhances throughput in two distinct ways.
Suzhou, China
ACCRETECH AD3000T/S
- used
- Manufacturer: Accretech - Tokyo Seimitsu - TSK
Tokyo Seimitsu Dicing Machine realizes the remarkable "CoO (Cost of Ownership)" by the world smallest footprint, high throughput, and high processing quality reinforced by the collaboration of the up-to-date tech...
Suzhou, China
HGTECH Wafer Slotting Series Wafer Laser Slotting Equipment
- new
- Manufacturer: Hgtech
Product advantages: Use ultra short pulse processing to reduce edge collapse, delamination and thermal impact, and adopt high-precision visual positioning to ensure the slotting position Based on spatial light mo...
Wuhan, China
ACCRETECH PS280Plus
- used
- Manufacturer: Accretech - Tokyo Seimitsu - TSK
Now, with two independent stages, cutting and positioning can proceed in parallel. The result - a maximum dicing speed up to twice that previously possible! that previously possible! New connected handlers, short...
Suzhou, China