Used Wafer Grinding in China

RELIFE RELIFE RL-304R 260W Multi-port GaN Charger

• Manufacturer: RELIFE

Ean(gtin13): 6941590208909 | Sku: 1

IVG-2040/3040

Fully automatic single-axis thinning machine is suitable for 4-12 inches wafer grinding, equipped with robot up and down, and integrated with automatic centering, cleaning and drying functions, equipped with auto...

IVG-2020/3020

Semi-automatic single-axis thinning machine is suitable for 2-12 inches wafers and special specification material grinding, manual loading mode, simple operation, rich features, configuration of automatic thickne...

IVG-2035/3035

Semi-automatic dual-axis thinning machine is suitable for 2-12 inches wafers and special specifications of the material grinding, manual loading mode, easy to operate, feature-rich, single-axis and dual-axis proc...

TAP-500/600 Dual series

This series of polishing machine is a high precision single-sided polishing equipment with double polishing discs, which can realize four-axis simultaneous processing, and the equipment can be configured accordin...

TFG-2200/3200 series

This equipment is a dual spindle three-station automatic thinning machine for 6/8-inch wafer grinding, with high-precision spindles, equipped with robotic loading and unloading, integrated with automatic centerin...

TFG-3250

This equipment is a 3-spindle, 4-station automatic thinning machine for 6/8-inch wafer grinding, with high-precision spindles, equipped with robotic loading and unloading, integrated with auto-centering, transfer...

TSG-200A

The machine is a double spindle, double table, through the diamond grinding wheel, the resin material will be processed by the creep-feed grinding method, with automatic thickness measurement, multi-stage grindin...

TDL-600/1200

This series of double-sided grinding machine is a high-precision, high-stability grinding and processing equipment, with the upper disc, lower disc, inner ring active drive, can be customized according to custome...

TAP-400/450/500/600 series

This series of polishing machine is a double-axis high-precision single-sided polishing equipment, equipment can be configured according to different wafers with the corresponding polishing head, vacuum adsorptio...

TSP-610/810/910/1270/1500 series

This series of polishing machine is a ceramic disk as a carrier, through the paste wax or no wax adsorption way to fix the wafer for polishing of high-precision single-sided polishing equipment, dual-axis, four-a...

TDP-1200/1204/1500 series

This series of double-sided polishing machine adopts the upper polishing disc can be swung out of the design, airbag pressure way, with different polishing pads, polishing liquid can realize the double-sided poli...

TMP-200S

This series of equipment is suitable for CMP polishing equipment for thin films (dielectric layers), including oxide, metal, STI, SOI, MEMS and other products of planarization polishing. It adopts multi-partition...

TSP-380

The equipment is desktop high-precision single-side polishing equipment, the equipment occupies a small area, easy to operate, can be matched with copper disk, tin disk, glass disk, stainless steel disk, etc., wi...

Mechanical spindle wafer grinder

Main purpose of the equipment: Mainly used for thinning and grinding of hard and brittle materials such as sapphires, semiconductors,ceramics, quartz crvstals, and circuit poard packaging ) The equipment adopts a...