Semiconductors » Wafer Slicing / Dicing » Guangdong

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Used Wafer Slicing / Dicing in Guangdong, China

  • Universal AI 51208502 Cutter

    Universal AI 51208502 Cutter

    • Manufacturer: Yinuo

    Shenzhen, China
  • 1019822-250 MPM BLADE 250mm

    1019822-250 MPM BLADE 250mm

    • Manufacturer: Yinuo

    Shenzhen, China
  • 1019822-450 MPM BLADE 450mm

    1019822-450 MPM BLADE 450mm

    • Manufacturer: Yinuo

    Shenzhen, China
  • 1017192-300 MPM BLADE 300mm

    1017192-300 MPM BLADE 300mm

    • Manufacturer: Yinuo

    Shenzhen, China
  • 1019822-350 MPM BLADE 350mm

    1019822-350 MPM BLADE 350mm

    • Manufacturer: Yinuo

    Shenzhen, China
  • 6inch Dicing saw for semiconductor

    6inch Dicing saw for semiconductor industry

    • Manufacturer: Minder Hightech

    Application: IC,Optical,communication,LED,MEMS,Medical,NTC,Quartz,Diode,Triode etc. | Material suitable: Si,GaAsLiNbO3,Al2O3,Ceramic,Glass,Quartz,PCB,EMC etc.

    Guangzhou, China
  • Semi automatic wafer expander

    Semi automatic wafer expander

    • Manufacturer: Minder Hightech

    Semi automatic film cutting and expanding machine chip packaging semi automatic crystal expanding machine 6 inch 8 inch 10 inch 12 inch film expanding equipment 1、 Introduction: Wafer expander is also called wafe...

    Guangzhou, China
  • MDHYDS12FA 12 inch discing saw

    MDHYDS12FA 12 inch discing saw for semiconductor industry

    • Manufacturer: Minder Hightech

    Application: IC，Optical Optoelectronics，Communications，LED package，QFN package，DFN package，BGA package | Material suitable: Silicon wafer, lithium niobate, ceramic, glass, quartz, alumina, PCB board

    Guangzhou, China

Overview

Wafer dicing is the process of cutting semiconductor wafers into individual chips or die. This is a critical step in semiconductor manufacturing, where precision and cleanliness are paramount. The process typically involves the use of high-precision saws or lasers to ensure each chip is separated without damaging the delicate structures within.

FAQ

What should I consider when buying a wafer dicing machine?

Consider the precision of the machine, the type of cutting technology (saw or laser), the throughput, and compatibility with the wafer sizes you plan to process. Also, check for features that ensure minimal damage and high accuracy.

How do I ensure the wafer dicing machine is shipped safely to my location?

Use a reputable transport service with experience in handling sensitive and high-tech machinery. Ensure the machine is securely packed, ideally in its original packaging, and protected from vibrations and shocks during transit.

What is the maintenance schedule for a wafer dicing machine?

Regular maintenance includes cleaning the cutting area, checking and replacing blades or laser components, and ensuring all moving parts are lubricated. Follow the manufacturer's maintenance guidelines for detailed instructions and intervals.