West Bond 7372B 63226
- Manufacturer: West Bond
West Bond 7372B Convertible Epoxy & Eutectic Die Bonder. Simple change of a tool head allows for use as either epoxy or eutectic die bonder. With pick-up tool rotation and radiant heat. Microprocessor controller ...
Hypervision Chip Unzip 48882
- Manufacturer: Hypervision
Hypervision Chip Unzip Backside Preparation System. Low stress backside preparation system is useful for the development and analysis of flip-chips, lead-on-chips packaging and advanced chip design with more than...
$3,500 USDFreehold Township, NJ
Royce SMS-250G-21857 64960
- Manufacturer: Royce Instruments
Royce 600 Series 250g Bond Shear Load Cell. Model SMS-250g-2185. 250 Gram Bond Shear test module. All test modules have four software-selectable subranges down to 1/10 of full scale, to maximize the versatility ...
$2,500 USDFreehold Township, NJ
Royce DE35 Pick and Place System 65124
- Manufacturer: Royce Instruments
- Model: DE 35
ROYCE DE35 Pick and Place System For picking die from sawn or scribed wafers mounted on adhesive film. Picks die as small as 6 mil sq. Pick and Place program storage. 110/240V, 50/60 Hz.
Freehold Township, NJ
Royce Instruments DE 35 Die Bonder
- Manufacturer: Royce Instruments
- Model: DE 35
Good condition Royce Instruments DE 35 Die Bonders. Located in USA and other countries. Click request price for more information.
USA
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