Used Die Bonders in Singapore

FC150: The Most Flexible High Accuracy Die Bonder

FC300: The High Force and High Accuracy Die Bonder for Large Devices

The FC300 High Precision Die / Flip Chip Bonder is the newest generation of high accuracy and high force system for chip-to-chip and chip-to-wafer bonding, on wafers up to 300 mm. The tool features automated hand...

ACCµRA Plus: Dedicated to production for Optoelectronic and Silicon photonics applications

The ACCµRA Plus is a flip-chip bonder designed for ± 0.5 μm accuracy in full automatic mode. It is suitable for reflow and thermocompression processes. ACCμRA Plus combines high precision, flexibility and short c...

ASM 8912 Die Bonder

ASM 8930 Die Bonder Vintage: 2007

ESEC 2007 IC-8 Die Bonder

• Manufacturer: ESEC
• Model: 2007

ESEC 2008HS Plus Die Bonder

• Manufacturer: ESEC
• Model: 2008 HS Plus

ESEC 2008XP3 Die Bonder

• Manufacturer: ESEC
• Model: 2008 xP3

ESEC 2008HS3+ Die Bonder

• Manufacturer: ESEC
• Model: 2008

ESEC 2006PI Epoxy Lead Frame Die Attach

• Manufacturer: ESEC
• Model: 2006

ESEC 2100FC Flip-Chip Die Bonder

• Manufacturer: ESEC
• Model: 2100 FC