New Wafer Grinding

IVG-2035/3035

Semi-automatic dual-axis thinning machine is suitable for 2-12 inches wafers and special specifications of the material grinding, manual loading mode, easy to operate, feature-rich, single-axis and dual-axis proc...

TAP-500/600 Dual series

This series of polishing machine is a high precision single-sided polishing equipment with double polishing discs, which can realize four-axis simultaneous processing, and the equipment can be configured accordin...

TAP-400/450/500/600 series

This series of polishing machine is a double-axis high-precision single-sided polishing equipment, equipment can be configured according to different wafers with the corresponding polishing head, vacuum adsorptio...

TSG-200A

The machine is a double spindle, double table, through the diamond grinding wheel, the resin material will be processed by the creep-feed grinding method, with automatic thickness measurement, multi-stage grindin...

TSP-610/810/910/1270/1500 series

This series of polishing machine is a ceramic disk as a carrier, through the paste wax or no wax adsorption way to fix the wafer for polishing of high-precision single-sided polishing equipment, dual-axis, four-a...

TDL-600/1200

This series of double-sided grinding machine is a high-precision, high-stability grinding and processing equipment, with the upper disc, lower disc, inner ring active drive, can be customized according to custome...

TDP-1200/1204/1500 series

This series of double-sided polishing machine adopts the upper polishing disc can be swung out of the design, airbag pressure way, with different polishing pads, polishing liquid can realize the double-sided poli...

TMP-200S

This series of equipment is suitable for CMP polishing equipment for thin films (dielectric layers), including oxide, metal, STI, SOI, MEMS and other products of planarization polishing. It adopts multi-partition...

TSP-380

The equipment is desktop high-precision single-side polishing equipment, the equipment occupies a small area, easy to operate, can be matched with copper disk, tin disk, glass disk, stainless steel disk, etc., wi...

Silicon wafer polishing machine

• Manufacturer: Shin Nippon Koki

Mirror finishing machine for silicon wafers Adoption of originally developed operation system from wafer delivery to polishing and cleaning Target workpiece: Silicon wafer Automatic grinding of silicon ingot circ...

Manual Grinder

Manual grinder: Easy to operate, low energy consumption and Low noise and easy to clean and maintenance.

Mechanical spindle wafer grinder

Main purpose of the equipment: Mainly used for thinning and grinding of hard and brittle materials such as sapphires, semiconductors,ceramics, quartz crvstals, and circuit poard packaging ) The equipment adopts a...

Air spindle full automatic wafer grinder

□ Fully automatic wafer back thinning □ Grindable wafer size4 “/5”/6”/8” □ Two axis three disc mode □ Online thickness measurement □ Wafer cleaning and drying □ Dry in,dry out standard 2 air spindle + 3 mechanica...

Air spindle semi automatic wafer grinder

□ Semi automatic single axis wafer back thinning □ Grindable wafer size 4-8 " □ Single axis single disc mode □ Online thickness measurement □ Corresponding to irregular specifications MDXZ-G300HG □ Semi automatic...

Semi Auto-Grinding

• Manufacturer: semiconductor equipment manufacturing

Semiconductor Equipment Manufacturing Co., Ltd. is a well-known company that provides semiconductor equipment products. We provide strict quality control in the company. All our products meet the requirements and...