Mechanical spindle wafer grinder
new
Main purpose of the equipment: Mainly used for thinning and grinding of hard and brittle materials such as sapphires, semiconductors,ceramics, quartz crvstals, and circuit poard packaging ) The equipment adopts a...
Guangzhou, China
Air spindle full automatic wafer grinder
new
□ Fully automatic wafer back thinning □ Grindable wafer size4 “/5”/6”/8” □ Two axis three disc mode □ Online thickness measurement □ Wafer cleaning and drying □ Dry in,dry out standard 2 air spindle + 3 mechanica...
Guangzhou, China
Air spindle semi automatic wafer grinder
new
□ Semi automatic single axis wafer back thinning □ Grindable wafer size 4-8 " □ Single axis single disc mode □ Online thickness measurement □ Corresponding to irregular specifications MDXZ-G300HG □ Semi automatic...
Guangzhou, China
SGM-450V
new
SGM-450V Semiconductor industry, electronic connector industry, ceramic industry, tungsten steel industry, precision and high precision parts processing industry, precision mold industry, etc.
Shenzhen, China
MDG21503NC Full automatic wafer grinder
new
If can not see clearly , please contact us for document presentation.
Guangzhou, China
Full automatic wafer grinder MDG33004SNC for semiconductor
new
If can not see clearly , please contact us for document presentation.
Guangzhou, China
MDG21503NC Full automatic wafer grinder for semiconductor
new
If can not see clearly , please contact us for document presentation.
Guangzhou, China
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