Mechanical spindle wafer grinder
Main purpose of the equipment: Mainly used for thinning and grinding of hard and brittle materials such as sapphires, semiconductors,ceramics, quartz crvstals, and circuit poard packaging ) The equipment adopts a...
Guangzhou, China
Air spindle full automatic wafer grinder
□ Fully automatic wafer back thinning □ Grindable wafer size4 “/5”/6”/8” □ Two axis three disc mode □ Online thickness measurement □ Wafer cleaning and drying □ Dry in,dry out standard 2 air spindle + 3 mechanica...
Guangzhou, China
Air spindle semi automatic wafer grinder
□ Semi automatic single axis wafer back thinning □ Grindable wafer size 4-8 " □ Single axis single disc mode □ Online thickness measurement □ Corresponding to irregular specifications MDXZ-G300HG □ Semi automatic...
Guangzhou, China
SGM-450V
SGM-450V Semiconductor industry, electronic connector industry, ceramic industry, tungsten steel industry, precision and high precision parts processing industry, precision mold industry, etc.
Shenzhen, China
MDG21503NC Full automatic wafer grinder
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Guangzhou, China
Full automatic wafer grinder MDG33004SNC for semiconductor
If can not see clearly , please contact us for document presentation.
Guangzhou, China
MDG21503NC Full automatic wafer grinder for semiconductor
If can not see clearly , please contact us for document presentation.
Guangzhou, China
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