New Flip Chip Bonders

Automatic Wire and Chip Bonding Machine Made in China Card Antenna Machine

• Manufacturer: JINGUAN

Product Description Automatic Wire and Chip Bonding Machine made in China Card Antenna Machine Model NO JGBM-2000+ overall Dimension L1400 *W1200 *H1800mm Machine weight About 850kgs Electricity input AC 220V/50-...

ACCµRA M: New Manual Flip-Chip Bonder

The ACCμRA M is a manual flip-chip bonder that allows ± 3 μm accuracy. This equipment permits to align manually the components with a high level of precision. The motorized arm controls precisely the bonding forc...

ACCµRA100: Education and R&D oriented, High Accuracy Flip-Chip Bonder

The ACCµRA™100 is a semi-automatic flip-chip bonder that guarantees ± 0.5 µm placement accuracy. Its flexibility makes it ideal for developing a wide range of applications. ACCµRA™100 combines high precision, acc...

ACCµRA OPTO: High Accuracy Flip-Chip Bonder 0.5 μm

The ACCµRA OPTO is a flip-chip bonder that allows ± 0.5 μm accuracy. It is dedicated to low force and reflow processes. Motorized axes guarantee a high repeatability of your process. The ACCμRA Opto combines high...

NEO HB: New Automatic Flip-Chip Bonder, Hybrid/ Direct

With ± 1 µm (3 sigmas) post-bond accuracy in stand-alone or full automatic mode, the NEO HB is an automatic flip-chip bonder designed for production. Combining high precision, flexibility and very short cycle tim...