Used process engineering in China

2011 PECVD Double Chamber ULVAC CME-200J Plasma-Enhanced Chemical Vapor Deposition)

• Manufacturer: Ulvac
• Model: CME-200

CHAMBER 1 GAS BOX CONFIG GAS 1 Aera TC FC-R7800 SiH4(10%)/N2 500SCCM GAS 2 Aera FC-7700 N2O 2000SCCM GAS 3 Aera FC-7700 O2 100SCCM GAS 4 Aera FC-7700 CF4(0.424) 500SCCM PROCESS CHAMBER 1 CONGIF 250MMX250MM ...

PECVD Plasma enhanced chemical vapor deposition equipment

PECVD Plasma enhanced chemical vapor deposition equipment Product introduction ◆ Fully automatic control of process time, temperature, gas flow, valve action and reaction chamber pressure is realized by industria...

PVD Physical vapor deposition

PVD Physical vapor deposition Product introduction: It is widely used in the batch production of semiconductor and LED production lines, and can meet the various process requirements for the uniform deposition of...