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Used Wafer Slicing / Dicing in South Korea

  • Trusted Seller
    2013 DISCO DFL7360

    2013 DISCO DFL7360

    • Manufacturer: Disco
    • Model: DFL7360

    De-installed, Warehoused, Can be inspected Wafer size: 300MM

    Seoul, South Korea
  • Trusted Seller
    2008 DISCO DFD6360

    2008 DISCO DFD6360

    • Manufacturer: Disco
    • Model: DFD6360

    De-installed, Warehoused, Can be inspected

    Seoul, South Korea
  • Trusted Seller
    2007 ACCRETECH A-WD-300TX

    2007 ACCRETECH A-WD-300TX

    • Manufacturer: Accretech - Tokyo Seimitsu - TSK
    • Model: A-WD-300TX

    De-installed, Warehoused, Can be inspected Wafer size: 300MM

    Seoul, South Korea
  • Trusted Seller
    2004 TSK A-WD-300T

    2004 TSK A-WD-300T

    • Manufacturer: Accretech - Tokyo Seimitsu - TSK
    • Model: A-WD-300T

    De-installed, Warehoused, Can be inspected Wafer size: 300MM

    Seoul, South Korea
  • Trusted Seller
    2013 DISCO+SEMES EAD6750

    2013 DISCO+SEMES EAD6750

    • Manufacturer: Disco
    • Model: EAD6750

    De-installed, Warehoused, Can be inspected Wafer size: 300MM

    Seoul, South Korea
  • Trusted Seller
    2011 TSK ML300PLUS II

    2011 TSK ML300PLUS II

    • Manufacturer: Accretech - Tokyo Seimitsu - TSK

    De-installed, Warehoused, Can be inspected Wafer size: 300MM

    Seoul, South Korea
  • Trusted Seller
    2010 DISCO DFL7340

    2010 DISCO DFL7340

    • Manufacturer: Disco
    • Model: DFL7340

    De-installed, Warehoused, Can be inspected

    Seoul, South Korea
  • Okamoto ADM6D

    Okamoto ADM6D

    • Manufacturer: Okamoto
    • Model: ADM-6D

    Application: Dicing for 6 inch | Axis/block: Item | Work size: ��6" (��152.4mm) | X-axis: Useable stroke | Cut speed: 0.1~250 | Y-axis: Useable stroke | Indexing step: 0.001 | Z-axis: Maximum cutting stroke | Mi...

    South Korea
  • DYNATEX INTERNATIONALTM DX-III

    DYNATEX INTERNATIONALTM DX-III

    • Manufacturer: Dynatex
    • Model: DX-III

    Application: Scribing | Automatic: Capable of complete, automatic scribing and breaking of many substrate materials | Cost effective: - System integration allows easy hook-up and transport - Superior yield and i...

    South Korea
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    2009 Disco+Towa 6340 and Towa SBS9000

    • Manufacturer: Towa

    Package saw

    Yongin-si, South Korea
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    2010 安永yasunaga TW-320C 2 Sets

    • Manufacturer: 安永yasunaga

    Solar battery wire saw

    Yongin-si, South Korea
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    SEZ Group 304

    • Manufacturer: SEZ Group

    Wafer size: 12"

    Yongin-si, South Korea
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    1995 Sumitomo KC-200A

    • Manufacturer: Sumitomo

    Wafer size: 8

    Yongin-si, South Korea
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    Disco DFD6361 Wafer Slicing / Dicing

    • Manufacturer: Disco
    • Model: DFD6361

    Good condition Disco DFD6361 Wafer Slicing / Dicings available between 2004 and 2010 years. Located in USA and other countries. Click request price for more information.

    Asia
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    Disco DFD651 Wafer Slicing / Dicing

    • Manufacturer: Disco
    • Model: DFD651

    Good condition Disco DFD651 Wafer Slicing / Dicings available between 1996 and 2005 years. Located in South Korea and other countries. Click request price for more information.

    South Korea
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    Disco DFL7161 Wafer Slicing / Dicing

    • Manufacturer: Disco
    • Model: DFL7161

    Good condition Disco DFL7161 Wafer Slicing / Dicings manufactured in 2011. Located in USA and other countries. Click request price for more information.

    Europe
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