Used Wafer Slicing / Dicing in China

HGTECH LUSD3310 Fully Automatic SiC Wafer Modification and Cutting Equipment

• Manufacturer: Hgtech

The Fully Automatic SiC Wafer Modification and Cutting Equipment LUSD3310 uses multiple high-precision CCD vision cameras to automatically identify and locate 6-8 inch wafers with various die specifications. Comb...

DX485C Multi-wire Saw

• Manufacturer: Beijing Sinopoly Technology

Technique features This cutting machine is effective cutting equipment, which have high accuracy and good features, and can cut piezo quartz, semiconductor monocrystalline that used in the semiconductor and micro...

YBDX160 Diamond Multi-wire Saw

• Manufacturer: Beijing Sinopoly Technology

Model.160 is mainly used for highly speeding and highly precisely slicing 2" , 4" ,6" sapphire ingot in mass prodution. The equipment can achieve a very good stable performance featured with low noise, low vibrat...

DX2231HC Multi-wire Saw

• Manufacturer: Beijing Sinopoly Technology

Technique features This cutting machine is effective cutting equipment, which have high accuracy and good features, and can cut piezo quartz, semiconductor monocrystalline that used in the semiconductor and micro...

Dicing Machine AD2000T/S

• Manufacturer: SSMC

Achieved smallest footprint possible utilizing our own core technology. Feature1 nWorld's most efficient Dicing Machine Delivering fast X-axis (Up to 1,000mm/sec) and Y-axis (Up to 300mm/sec) processing speed. Lo...

HGTECH Wafer Slotting Series Wafer Laser Slotting Equipment

• Manufacturer: Hgtech

Product advantages: Use ultra short pulse processing to reduce edge collapse, delamination and thermal impact, and adopt high-precision visual positioning to ensure the slotting position Based on spatial light mo...

ACCRETECH SS10

• Manufacturer: Accretech - Tokyo Seimitsu - TSK
• Model: SS10

Fastest and smallest 6-inch dicing machine. Improved operability with the 17-inch touch panel screen. The image-processing engine accommodates variety of work. Feature1 Fastest and smallest 6-inch dicing machine ...

ACCRETECH SS30

• Manufacturer: Accretech - Tokyo Seimitsu - TSK
• Model: SS30

12-inch dicing machine Small footprint with highly stable structure. Compliant with varieties of work Feature1 nFootprint Small footprint with highly stable structure nCompliant with varieties of work ・300mm wafe...

ACCRETECH ML300Plus ⅡWH

• Manufacturer: Accretech - Tokyo Seimitsu - TSK
• Model: ML300Plus-WH

12-inch laser dicing machine with wafer handling system. We have developed a dicing machine equipped with stealth dicing technology (developed by Hamamatsu Photonics) as a stealth dicing The dicing machine is equ...

ACCRETECH SS20

• Manufacturer: Accretech - Tokyo Seimitsu - TSK
• Model: SS20

8-inch dicing machine Small footprint with highly stable structure. Compliant with the large work Feature1 nFootprint Small footprint with highly stable structure nCompliant with large wafers 250mm square work si...

ACCRETECH ML200Plus FH

• Manufacturer: Accretech - Tokyo Seimitsu - TSK
• Model: ML200Plus

8-inch laser dicing machine with dicing frame handling system. We have developed a dicing machine equipped with stealth dicing technology (developed by Hamamatsu Photonics) as a stealth dicing engine, exhibiting ...

ACCRETECH AD20T/S

• Manufacturer: Accretech - Tokyo Seimitsu - TSK
• Model: AD20T

Revolutionary axis design orientation creates the smallest twin spindle Dicing Saw Dicing Saw nFoot print The world's smallest footprint Footprint reduced 40% compared with Accretech's existing machines nHigh Thr...

ACCRETECH ML200PLUS

• Manufacturer: Accretech - Tokyo Seimitsu - TSK
• Model: ML200Plus

ACCRETECH AD3000T/S

• Manufacturer: Accretech - Tokyo Seimitsu - TSK
• Model: AD3000T

Tokyo Seimitsu Dicing Machine realizes the remarkable "CoO (Cost of Ownership)" by the world smallest footprint, high throughput, and high processing quality reinforced by the collaboration of the up-to-date tech...

ACCRETECH PS280Plus

• Manufacturer: Accretech - Tokyo Seimitsu - TSK

Now, with two independent stages, cutting and positioning can proceed in parallel. The result - a maximum dicing speed up to twice that previously possible! that previously possible! New connected handlers, short...