Used Assembly / Packaging (Semiconductors)

Disco DAD-562

• Manufacturer: Disco
• Model: DAD562

Application: Dicing/Cutting/Slotting various wafers | ▲ workpiece handling size: ø152.4 mm (ø6") (max. diameter) | ▲ maximum blade size: 58 mm | ▲ applications: Silicon, Glass, Quartz, Ceramics, etc.

EXATRON 902 HANDLER SYSTEM

• Manufacturer: EXATRON

1. Input : Bowl-feed or JEDEC tray/waffle 2. Output : JEDEC Tray/waffle or Cannister 3. Pick up head x 4. 4. Tri-temp. 5. Kit QFN 2x3mm

2025 TWS Quadra DVC

Listed: 18/03/2025

2009 Battenfeld 300T/HM-2250 1013

• Manufacturer: Battenfeld

Clamping force: 300 | Snail: 65 | Snail armored: Armored | Armored coat: Armored | Spar width: 710 x 630 | Wz. installation min.: 350 | Wz. installation max.: 650 | Wz. opening min.: 550 | Injection pressure: 20...

2011 KM 500/300 CRX 1014

• Manufacturer: KM

Clamping force: 500 | Snail: 60 | Snail armored: Armored | Spar width: 900 x 800 | Wz. installation min.: 480 | Wz. opening min.: 1170 | Injection pressure: 2420 | Shot volume: 792 | Maximum weight: 18 | Switch ...

2012 DISCO, DFL7160, Laser Scriber

• Manufacturer: Disco
• Model: DFL7160

N/A - CONDITION: As-is Equipment detail: Laser Scriber | Description: N/A

Disco DFL7160 Laser Saw

• Manufacturer: Disco
• Model: DFL7160

Disco Laser Saw DFL7020 Laser Cutting Machine

• Manufacturer: Disco
• Model: DFL7020

Disco DAD321 Wafer Saw Dicing Saw Wafer Dicing Machine

• Manufacturer: Disco
• Model: DAD321

Disco 12 inches Wafer Saw DFD6360 12-inch Wafer Dicing Machine

• Manufacturer: Disco
• Model: DFD6360

Disco DAD341 8 inches wafer saw 8 inches cutting machine Scribing machine

• Manufacturer: Disco
• Model: DAD341

Disco DAD3350 Assembly / Packaging (semiconductors)

• Manufacturer: Disco
• Model: DAD3350

Good condition Disco DAD3350 Assembly / Packaging (semiconductors)s available between 2008 and 2011 years. Located in USA and other countries. Click request price for more information.