Used processing in Guangdong, China

SMT Multifunctional bulk capacitance clipper

● Suitable for DIP automatic production of wire components for cutting foot, full line automation and high output of essential products ● Capacitors, resistors, LED and so on can be cut feet, suitable for mass pr...

ERSA HOTFLOW 3/14 Reflow Soldering Machine

• Manufacturer: Ersa

Weight appr. 2,500 kg The Ersa HOTFLOW 3/14 reflow system is of robust design and manufactured entirely from steel, welded air-tight, powder coated and with interior electric cabinet and a PC operating terminal. ...

ERSA HOTFLOW 4/8 Reflow Soldering Machine

• Manufacturer: Ersa

Weight app. 1,100 kg High performing compact reflow system Multi-stage cooling, both internal and external Efficient process gas cleaning system Low N2 consumption Auto Profiler for quick profile generation Multi...

ERSA HOTFLOW 4/14 Reflow Soldering Machine

• Manufacturer: Ersa

Weight appr. 2,000 kg Reflow soldering system with outstanding thermal performance and an excellent power balance Individually controllable process zones via energy-optimized motors Multi-level controlled cooling...

ERSA HOTFLOW 4/20 Reflow Soldering Machine

• Manufacturer: Ersa

Weight appr. 2,600 kg Reflow soldering system with outstanding thermal performance and an excellent power balance Individually controllable process zones via energy-optimized motors Multi-level controlled cooling...

ERSA HOTFLOW 3/20 Reflow Soldering Machine

• Manufacturer: Ersa

Up to 20 convections heating cassettes (Preheating up to 14 cassettes, reflow zone up to 6 cassettes) Up to 4 levels cooling zone with water back-cooling Extraction rate 2x 400 m3/h with monitoring feature Weight...

SUNEAST SUNFLOW DS/450Z SUNFLOW DS/610Z Selective Wave Soldering Machine

Double electromagnetic pump design the efficiency increased by 1 times ； Double solder pots independent lifting Using German brand drip nozzle with high precision High efficiency and energy saving top quality Sta...

EKRA SERIO 4000 Solder paste printer

• Manufacturer: EKRA

Minimal footprint 100 x 127 cm Possibility to place 2 printers “back to back” Easy to use software with touchscreen Alignment repeatibility ± 12,5 μm @ 6 Sigma Program changeover < 2 min Closed loop with SPI (opt...

ERSA HOTFLOW 4/26 Reflow Soldering Oven

• Manufacturer: Ersa

The newly developed, smart Nitrogen control system substantially reduces the consumption of this costly consumable, offering, in conjunction with the efficient blower motors, a total reduction in energy use of mo...

ERSA HOTFLOW 3/14e Reflow Soldering Machine

• Manufacturer: Ersa

Weight appr. 1,450 kg The Ersa HOTFLOW 3/14e Reflow System is of robust design and manufactured entirely from steel, welded air-tight, powder coated and with interior electric cabinet and a PC operating terminal....

ERSA HOTFLOW 3/20e Reflow Soldering Machine

• Manufacturer: Ersa

Weight appr. 1,900 kg The Ersa HOTFLOW 3/20e Reflow System is of robust design and manufactured entirely from steel, welded air-tight, powder coated and with interior electric cabinet and a PC operating terminal....

DEK NeoHorizon Solder paste printer

• Manufacturer: DEK

DEK NeoHorizon Solder paste printer Maximum flexibility for the integrated smart factory With its modular and scalable configuration options, the DEK NeoHorizon printer meets any process requirements and offers b...

JT US-350 US-450 US-610 Wave Soldering Machine

● The movement of the nozzle realizes dual-axis linkage in the X.Y direction, and is driven by a stepping motor, with accurate positioning. The programming control method is flexible, which can meet the complex p...

DEK TQ Solder paste printer

• Manufacturer: DEK

The DEK TQ is superfast (core cycle time: only 5 to 6.5 seconds), highly precise (±17.0 microns @ 2 cmk), and a real space-saver. With two model versions, the platform now also features outstanding flexibility: t...

GKG C100 SMT Solder paste printer

The pursuit of innovation, therefore excellence Climber·C100 is a high-precision application equipment of GKG Cohesive core technology; 2. One general purpose to meet a variety of semiconductor packaging process ...