HGTECH Wafer Defect Detection Series Semiconductor Wafer Defect Detection Equipment in Wuhan, Hubei, China
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Specifications
- Condition
- new
- Item
- Main parameters
- General parameters
- Wafer size; 4 ", 6" (Iron frame with blue film)
- Number of boxes
- 2 pcs
- Loading and unloading method
- Robot, mapping scanning
- Motion platform
- X stroke 200mm, repetitive accuracy 10μm Y stroke 45mm，repetitive accuracy 10μm Z strooke 15mm，repetitive accuracy 5μm
- Capacity
- 4" , 25WPH 6" , 20WPH
- Detection performance
- Test accuracy; 3 μm
- Camera
- High resolution industrial camera
- Lens
- Microlens
- Light source
- Patented light source
- Defect marking
- Automatic dotting
- Environment requirement
- Power supply specification; AC220V， 50Hz
- Air source requirements
- 0 .5-0 .7Mpa compressed air, without obvious water vapor and grease
- Using environment
- Temperature: 15-40 ℃. Humidity requirement: 30% - 70%, no frost
- Overall size
- 2000mm*1200mm*2250mm
- Subcategory
- Specialized products
- Subcategory 2
- Specialized products for semiconductor industry
- Listing ID
- 73915112
Description
Product advantages: This equipment can be used for 4-8 inch patterned wafers Detect defects such as scratch, back collapse, color difference, crack, scratch, metal residue and metal loss System resolution: 0.2-0.8 μ m Patterned wafer: 15 minutes / wafer when the number of defects is less than 200 Sample display:The gold plating layer falls off Crackle Coating surface detection Scratch