VISCOM iS6052 3D SPI Machine in Shenzhen, Guangdong, China
New
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Specifications
- Condition
- new
- System housing
- 997 mm x 1756 mm x 1753 mm
- Resolution
- 12 µm
- Pcb dimensions
- 508 mm x 508 mm (20" x 20")
- Global libraries, global calibration
- transferability to all systems
- Defects/defect features
- too much/too little solder, missing solder, print displacement (X/Y offset), paste smearing
- Optional
- coplanarity, open area analysis, OCR, DMC
- Subcategory
- Smt spi machine
- Subcategory 2
- Smt inspection equipment
- Listing ID
- 103134211
Description
Z-range:：Up to 5 mm
Introducing the iS6052 SPI, Viscom's solution for inspecting solder paste applications in SMD production with remarkable efficiency and accuracy. Emerging from over forty years of expertise, this 3D inline system meticulously evaluates critical features like volume, height, and shape, alongside surface area, displacement, and smearing. Equipped with innovative sensor technology including an orthogonal camera and four lateral views, it ensures unparalleled inspection quality. Realistic color imaging facilitates swift and precise verification, while the Fast Flow handling system guarantees exceptional throughput by synchronizing assembly input and output. With minimal handling times and reduced mechanical impact, this system optimizes efficiency without compromising performance. Intelligent networking capabilities further bolster process stability and streamline operations within the SMT line.
Proven 3D camera technology
Meets demanding cycle time requirements