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9

Used Wafer Slicing / Dicing in Germany

  • Trusted Seller
    2017 Lintec Corporation RAD-2010M/12

    2017 Lintec Corporation RAD-2010M/12

    • Manufacturer: Lintec
    • Model: RAD-2010M12

    A semi-automatic UV irradiation system for UV curable dicing tape attached to ring frame for 300mm wafer.

    Erfurt, Germany
  • Trusted Seller
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    2007 Tokyo Seimitsu Co SEP200B

    • Manufacturer: Accretech - Tokyo Seimitsu - TSK
    • Model: SEP200B

    8" Separator for stealth laser diced 8" wafer

    Germany
  • Trusted Seller
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    2012 Tokyo Seimitsu Co SEP300

    • Manufacturer: Accretech - Tokyo Seimitsu - TSK
    • Model: SEP300

    12" Separator for stealth laser diced 12" wafer

    Germany
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    2007 Tokyo Seimitsu Co., AWD200T

    • Manufacturer: Accretech - Tokyo Seimitsu - TSK
    • Model: A-WD-200T

    Trf_WAFER SAW_ACCRETECH AWD200T_WSTSK00163 Width: 45.669  in  (116.0 cm) | Depth: 53.150  in  (135.0 cm) | Height: 48.622  in  (123.5 cm) | Weight: 2,866  lb  (1,300 kg)

    Regensburg, Germany
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    2004 Tokyo Seimitsu Co., AWD200T

    • Manufacturer: Accretech - Tokyo Seimitsu - TSK
    • Model: A-WD-200T

    Trf_WAFER SAW_ACCRETECH AWD200T_WSTSK10136 Width: 45.669  in  (116.0 cm) | Depth: 53.150  in  (135.0 cm) | Height: 48.622  in  (123.5 cm) | Weight: 2,866  lb  (1,300 kg)

    Regensburg, Germany
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    2003 Tokyo Seimitsu Co., AWD200T

    • Manufacturer: Accretech - Tokyo Seimitsu - TSK
    • Model: A-WD-200T

    Trf_WAFER SAW_ACCRETECH AWD200T_WSTSK10116 Width: 45.669  in  (116.0 cm) | Depth: 53.150  in  (135.0 cm) | Height: 48.622  in  (123.5 cm) | Weight: 2,866  lb  (1,300 kg)

    Regensburg, Germany
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    2000 Tokyo Seimitsu Co., AWD200T

    • Manufacturer: Accretech - Tokyo Seimitsu - TSK
    • Model: A-WD-200T

    Trf_WAFER SAW_ACCRETECH AWD200T_WSTSK00162 Width: 45.669  in  (116.0 cm) | Depth: 53.150  in  (135.0 cm) | Height: 48.622  in  (123.5 cm) | Weight: 2,866  lb  (1,300 kg)

    Regensburg, Germany
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    Accretech - Tokyo Seimitsu - TSK SEP300 Wafer Slicing / Dicing

    • Manufacturer: Accretech - Tokyo Seimitsu - TSK
    • Model: SEP300

    Good condition Accretech - Tokyo Seimitsu - TSK SEP300 Wafer Slicing / Dicings manufactured in 2012. Located in Germany and other countries. Click request price for more information.

    Germany
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    Accretech - Tokyo Seimitsu - TSK SEP200B Wafer Slicing / Dicing

    • Manufacturer: Accretech - Tokyo Seimitsu - TSK
    • Model: SEP200B

    Good condition Accretech - Tokyo Seimitsu - TSK SEP200B Wafer Slicing / Dicings manufactured in 2007. Located in Germany and other countries. Click request price for more information.

    Germany