- Trusted Seller
2017 Lintec Corporation RAD-2010M/12
- Manufacturer: Lintec
- Model: RAD-2010M12
A semi-automatic UV irradiation system for UV curable dicing tape attached to ring frame for 300mm wafer.
Erfurt, Germany - Trusted Seller
2007 Tokyo Seimitsu Co SEP200B
- Manufacturer: Accretech - Tokyo Seimitsu - TSK
- Model: SEP200B
8" Separator for stealth laser diced 8" wafer
Germany - Trusted Seller
2012 Tokyo Seimitsu Co SEP300
- Manufacturer: Accretech - Tokyo Seimitsu - TSK
- Model: SEP300
12" Separator for stealth laser diced 12" wafer
Germany 
Accretech - Tokyo Seimitsu - TSK SEP300 Wafer Slicing / Dicing
- Manufacturer: Accretech - Tokyo Seimitsu - TSK
- Model: SEP300
Good condition Accretech - Tokyo Seimitsu - TSK SEP300 Wafer Slicing / Dicings manufactured in 2012. Located in Germany and other countries. Click request price for more information.
GermanyAccretech - Tokyo Seimitsu - TSK SEP200B Wafer Slicing / Dicing
- Manufacturer: Accretech - Tokyo Seimitsu - TSK
- Model: SEP200B
Good condition Accretech - Tokyo Seimitsu - TSK SEP200B Wafer Slicing / Dicings manufactured in 2007. Located in Germany and other countries. Click request price for more information.
Germany
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