Used Assembly / Packaging (Semiconductors)

1997 Disco DFD651 Fully Automatic Dicing Saw

• Manufacturer: Disco
• Model: DFD651

Very good condition Came from a lab in Japan Low hours

2009 Disco DFL 7160

• Manufacturer: Disco
• Model: DFL7160

Process Laser saw Vintage 2009 Wafer Size 8 inch ( Max Workpiece Size 12 inch) Voltage 200~240 VAC ± 10%, 3 Phase Equipment component Main body Main power Loadlock Laser type:A type No Chiller

DISCO DFL7161 Laser Wafer Saw used semiconductor equipment

• Manufacturer: Disco
• Model: DFL7161

Disco DFL7161 Laser Saw Vintage 2011 UV Laser 355nm; Wafer size 4 to 8 inch; Handling for Disco 6″ or 8″ frames; Cleaning station, PVA spin coating system; Quartz chuck; 17.99hr laser running Photos attached. Eur...

Disco DFD651 Fully Automatic Dicing Saw

• Manufacturer: Disco
• Model: DFD651

1993 Disco DFD620

• Manufacturer: Disco
• Model: DFD620

1993 Disco Dicing Saw DFD620

Disco DFD-651 Dicing Saw

• Manufacturer: Disco
• Model: DFD651

200mm As-is

RAD3500m12 300mm Semi-Automatic BG Tape Laminator working condition

• Manufacturer: Unknown

Running condition. 2005 Vintage

Disco DFD651 Dicing Saw

• Manufacturer: Disco
• Model: DFD651

Disco DFD651 Dicing Saw Vintage 1998 *WAFER DICING SAW *Used Semiconductor Equipment

DISCO DAD 3360 High Torque Dicing Saw

• Manufacturer: Disco
• Model: DAD3360

Specification Model Vintage High Torque Semi-Auto Dicer Chuck table & Cleaning table for 8-inch and 12-inch DAD3360 2016 2.2 kw Spindle Measurement alignment for CSP (Chip Size Package) Auto dress Edge alignment ...

Disco EAD6340 dicing saw

• Manufacturer: Disco
• Model: EAD6340

Disco EAD6340 dicing saw Vintage 2005 Max. 8 inch, has NCS, has BBD Working condition

Disco DFD651

• Manufacturer: Disco
• Model: DFD651

Disco DFD 651 Spec : (1) for 8” wafer saw (2) Spindle is 2” (3) dual blade

Disco DFD6361 dicing saw

• Manufacturer: Disco
• Model: DFD6361

Disco DFD6361 dicing saw Vintage 2009 Max. 12 inch, has NCS, has BBD Working condition

Disco DFD6361 wafer dicing saw 300mm

• Manufacturer: Disco
• Model: DFD6361

Disco DFD6361 Wafer Dicing Saw Configuration: Touch Screen Display with GUI interface Standard 1.2 kW Spindles x2 Automatic Wheel Covers and Sensors Dual Cameras for simultaneous Z1/Z2 kerf check plus Hi-Lo Mag A...

DISCO DFD6361 DICING SAW

• Manufacturer: Disco
• Model: DFD6361

Disco DFD6361 *Touch Screen Display GUI interface *Standard 1.2kW spindle(2) *Automatic wheel covers and sensors *Dual cameras for simultaneous Z1/Z2 kerf check plus HiLo Mag *Auto all system condition monitor *A...

Disco DFD 6361 Dicing saw

• Manufacturer: Disco
• Model: DFD6361

Disco DFD 6361 Dicing saw Currently Configured for 300mm wafer size System power rating: 200 – 240 VAC +/- 10%, 3 Phase, 50/60Hz, 18A (Full Load Amps) Loading configuration: load and unload wafer on same cassette...