1996 DISCO DAD2H6T
- Manufacturer: Disco
- Model: DAD2H/6T
Suzhou, China
1997 DISCO DAD321
- Manufacturer: Disco
- Model: DAD321
The DAD321 dices a workpiece with diameter up to 6 inch using a high-output air spindle with a The DAD321 dices a workpiece with diameter up to 6 inch using a high-output air spindle with a diamond blade attached...
Suzhou, China
1996 DISCO DAD2H6T
- Manufacturer: Disco
- Model: DAD2H/6T
The Disco dfg840, a classic 8-inch wafer grinding equipment, can be compatible with 4-5-6-inch wafers. The company has a professional after-sales team to provide relevant installation, commissioning and maintenan...
Suzhou, China
Taipei City, TaiwanDisco EAD6361
- Manufacturer: Disco
- Model: EAD6361
Semiconductor Equipment Manufacturing, Inc. is one of the largest supplier of Wafer Dicing Machine in Taiwan. Being specialized in our products for many years, our top ranking sales are due mostly in part to word...
Hsinchu County, Taiwan
Disco DFL 7161
- Manufacturer: Disco
- Model: DFL7161
Fully automatic laser saw for 300 mm wafers DFL7161, review the config as below.
Hsinchu County, Taiwan
Tokyo, Japan- Tokyo, Japan
- Tokyo, Japan
- Tokyo, Japan
2014 LINTEC RAD-3510F12
- Manufacturer: Lintec
- Model: RAD-3510F12
Manufacturing process: assembly | Inch: 8,12
Tokyo, Japan- Tokyo, Japan
- Tokyo, Japan
2017 DISCO DFD6340
- Manufacturer: Disco
- Model: DFD6340
Manufacturing process: assembly | Inch: Square Substrate
Tokyo, Japan- Tokyo, Japan
Disco DFD641 Assembly / Packaging (semiconductors)
- Manufacturer: Disco
- Model: DFD641
Good condition Disco DFD641 Assembly / Packaging (semiconductors)s available between 1999 and 2002 years. Located in Ireland and other countries. Click request price for more information.
Ireland
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