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Used Wafer Slicing / Dicing in Japan

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    LGR-Series

    • Manufacturer: TOWA JAPAN

    Enables high-precision blade cutting of lead-less device products such as QFN packages. Selectable blade cut(FMS3040-HC) or laser cut(LGR1040) depending on process and lead frame design. Combining dedicated lead ...

    Kyoto, Japan
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    2008 TSK A-WD-10B

    • Manufacturer: Accretech - Tokyo Seimitsu - TSK
    • Model: A-WD-10B

    Manufacturing process: assembly | Inch: 6

    Tokyo, Japan
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    2018 SHIBASOKU WL15V

    • Manufacturer: SHIBASOKU

    Manufacturing process: ATE

    Tokyo, Japan
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    TSK A-WD-100A

    • Manufacturer: Accretech - Tokyo Seimitsu - TSK
    • Model: A-WD-100A

    Manufacturing process: assembly

    Tokyo, Japan
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    ASTRO SE-6003

    • Manufacturer: Astro

    Manufacturing process: ATE | Inch: 8

    Tokyo, Japan