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HGTECH LUSD3310 Fully Automatic SiC Wafer Modification and Cutting Equipment
- Manufacturer: Hgtech
The Fully Automatic SiC Wafer Modification and Cutting Equipment LUSD3310 uses multiple high-precision CCD vision cameras to automatically identify and locate 6-8 inch wafers with various die specifications. Comb...
Wuhan, China
HGTECH PW Series PW Automatic Laser Tailor Welding Machine
- Manufacturer: Hgtech
Features:● Consist of welding part, steel sheet position structure, sheet dragging structure and automatic feeding robot hand● Each axis is transmitted by high precision pinion and rack and ball screw● High effic...
Wuhan, China
HGTECH WALC-Q Series WALC High Power 2D Laser Cutting Machine
- Manufacturer: Hgtech
- Cutting thickness: 100 millimeter
WALC-Q seriesWALC High Power 2D Laser Cutting Machine The lightweight WALC-Q series high-power laser cutting machine is designed for processing construction machinery, steel towers, and integration into automatic...
Wuhan, China