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Used Flip Chip Bonders in Gyeonggi-do, South Korea

  • 2014 Shibuya, DB250, Flip Chip

    2014 Shibuya, DB250, Flip Chip Bonder

    • used

    • Manufacturer: Shibuya

    240x100mm, Wafer 12" - CONDITION: As-is Equipment detail: Flip Chip Bonder | Description: 240x100mm, Wafer 12"

    Suwon-si, South Korea
  • PANASONIC NM-SB50A Flip Chip Bonder

    PANASONIC NM-SB50A Flip Chip Bonder

    • used

    • Manufacturer: Panasonic

    Panasonic NM-SB50A Flip Chip Bonder •APPLICABLE SUBSTRATE SIZE : 50 mm square to 330 x 250 mm •APPLICABLE IC SIZE : 1 mm square to 20 mm square •DRY CYCLE TIME : 1.8s/IC •BONDING ACCURACY : 3 μm/3 •IC SUPPLY...

    Gyeonggi-do, South Korea