Used EVG Supporting Equipment (Semiconductors)

EVG EVG520 HE

• Manufacturer: EVG

Complete and in working condition upon being removed from service. 2016 Configuration Bonder OEM Model Description The EVG520 HE is a cutting-edge semi-automated hot embossing system, specifically tailored f...

EVG EVG520 HE

• Manufacturer: EVG

EVG EV420

• Manufacturer: EVG

Used EVG 420 Bond Aligner H-line system with double-sided mask alignment capabilities

EVG EV420

• Manufacturer: EVG

2011 EVG 101

• Manufacturer: EVG
• Model: 101

Vintage 2011 Fully operational

EVG EV 640

• Manufacturer: EVG

- 3 phase 6", 8

2003 EVG EV620

• Manufacturer: EVG
• Model: EV620

6" As-is

2007 EVGroup (EVG) IQ ALIGNER

• Manufacturer: EVG
• Model: IQ ALIGNER

OEM Model Description "The IQ Aligner allows for imprint processes with stamps and wafers from 150 mm to 300 mm diameter. The tool’s configuration for nanotechnology applications can include stamp release mecha...

2022 EVG 560 Bonding System

• Manufacturer: EVG

EVG 560 AUTOMATED PRODUCTION WAFER BONDING SYSTEM consisting of: - Fully automated operation - Interlocked doors with signal light tower - 4 Axis Industrial Robot - EVG CIM Framework Software GUI (Graphical U...

EVG 520IS Semi-Automated Wafer Level Bonder

• Manufacturer: EVG
• Model: 520IS

Qty x 2 units Configurable for all wafer bonding processes such as anodic, thermo compression, fusion bonding, or LowTemp plasma bonding, Heater size = Max. wafer diameter: 150mm or 200mm, Bond chuck system, Max....

2000 EVG 850

• Manufacturer: EVG
• Model: 850

Vintage 2000 Available for full inspection and demonstration Fully-Automatic Suitable for wafer sizes up to 6"/150mm wafers Currently configured for 6"/150mm wafers One Genmark Robot with pre-aligner Two Cl...

EVG EVG-560

• Manufacturer: EVG

EVG EVG-560

EVG Machinery

• Manufacturer: EVG

EVG

EVG Machinery

• Manufacturer: EVG

EVG

EV Group EVG101 200 mm

• Manufacturer: EVG

EV Group EVG101 200 mm