- Trusted Seller

2007 EVGroup (EVG) IQ ALIGNER
- Manufacturer: EVG
- Model: IQ ALIGNER
OEM Model Description "The IQ Aligner allows for imprint processes with stamps and wafers from 150 mm to 300 mm diameter. The tool’s configuration for nanotechnology applications can include stamp release mecha...
United States - Trusted Seller

2023 EVG Lithoscale
- Manufacturer: EVG
EVG Lithoscale - Maskless Exposure System Up to 300mm, Low-Volume Manufacturing, automated substrate handling Brandnew and unsed System Out of package Hyperion Technical configuration: • For maskless exposur...
United States - Trusted Seller

EVG 520 Semi-Automatic Wafer bonders x 2 sets Both 2010 Year of Manufacture
- Manufacturer: EVG
- Model: 520
EVG 520 wafer bonders Currently installed and can be Tested with CSI Semi Engineer onsite. Serial No. SXXXX05 , (2010) Serial No. SXXXX78 , (2010) Semi-automated Wafer Bonders Configurable for all wafer bonding p...
Bree, Ireland - Trusted Seller

EVG 520IS Semi-Automated Wafer Level Bonder
- Manufacturer: EVG
- Model: 520IS
Qty x 2 units Configurable for all wafer bonding processes such as anodic, thermo compression, fusion bonding, or LowTemp plasma bonding, Heater size = Max. wafer diameter: 150mm or 200mm, Bond chuck system, Max....
Bree, Ireland - Trusted Seller

Bond Aligner EVG 520
- Manufacturer: EVG
- Model: 520
-Tooling for 6" Wafer inclusive Bond Chuck and Pressure Insert -Capable of fusion compression bonding -Capable of thermal compression bonding -Capable of anodic bonding -Ideal for R&D and pilot production app...
Europe - Trusted Seller

2023 EVG Lithoscale
- Manufacturer: EVG
Manufacturer: EVG Model: Lithoscale Year of Manufacture: 2023 Condition New-Never Used Technical configuration: • For maskless exposure of wafer sizes up to 300 mm • High precision stage including contactl...
Munich, Germany - Trusted Seller

EVG 101 Spin/Spray coater
- Manufacturer: EVG
Spin coating system has been upgraded to a spray coating capability system There are no known issues as it has never been installed/used and also, all parts are intact and available The current chuck can accomm...
Asia - Trusted Seller

2017 EVG 6200 NT
- Manufacturer: EVG
- Model: 6200
- Double side - Manual handling - Exposure Modes: Hard, Soft, & Vacuum Contact - Separation Distance: 0 - 300 µm adjustable via software - Wafer Thickness: 0.1 - 10 mm (For Top Side) - Semi Automatic Loading...
Singapore 
2000 EVG 520
- Manufacturer: EVG
- Model: 520
Vintage 2000 Manual wafer load substrate bonder Capable of fusion compression bonding Capable of thermal compression bonding Ideal for R&D and pilot production applications High-vacuum capable bond chamber Auto o...
Ashford, United Kingdom
EVG 501
- Manufacturer: EVG
- Model: 501
Refurbishment, warranty, installation, training, service and support available Available for full inspection and demonstration Manual wafer load substrate bonder Capable of fusion compression bonding Capable of t...
Ashford, United Kingdom
2012 EVG 6200 BA Infinity
- Manufacturer: EVG
- Model: 6200
Vintage 2012 Refurbishment, warranty, installation, training, service and support available Available for full inspection and demonstration Manual Bond Aligner Backside Alignment (BSA) Manual Handling Automatic J...
Ashford, United Kingdom
2011 EVG 610
- Manufacturer: EVG
Refurbishment, warranty, installation, training, service and support available Available for full inspection and demonstration Topside Alignment (TSA) Manual Handling Manual Controlled Stage Tooling Tray Uniformi...
Ashford, United Kingdom
EVG 620
- Manufacturer: EVG
- Model: 620
Refurbishment, warranty, installation, training, service and support available Available for full inspection and demonstration Topside Alignment (TSA) Manual Handling Manual Controlled Stage Tooling Tray Uniformi...
Ashford, United Kingdom
2000 EVG 850
- Manufacturer: EVG
- Model: 850
Vintage 2000 Refurbishment, warranty, installation, training, service and support available Available for full inspection and demonstration Fully-Automatic Suitable for wafer sizes up to 6"/150mm wafers Currently...
Ashford, United Kingdom
2023 EVG EVG Lithoscale
- Manufacturer: EVG
Up to 300mm, Low-Volume Manufacturing, automated substrate handling Brandnew and unsed System available for an attractive price! Out of package Hyperion Technical configuration: • For maskless exposure of wafer s...
Regensburg, Germany

