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2009 EVG, EVG810LT, Low Temp Plasma Activation System
- Manufacturer: EVG
Wafer 50-200, 100-300mm - CONDITION: Working Equipment detail: Low Temp Plasma Activation System | Description: Wafer 50-200, 100-300mm
Suwon-si, South KoreaEVG 810LT, Low Temp Plasma Activation System
- Manufacturer: EVG
- Equipment: Low Temp. Plasma Activation System for wafer bonding - Maker: EVG (EVGroup) - Model: EVG 810 LT - Type: Manual Type - EQP. Size(W*L*H): 1520*1210*1530 (mm) - Wafer Size: 50 ~ 200mm - Process : Silico...
Suwon-si, South Korea