Used ESEC 2008 Die Bonders

ESEC 2008XP Die Bonder Refurbished

• Manufacturer: ESEC
• Model: 2008 xP

ESEC 2008XP DIE BONDER DINP3, EST5, FPD3, MPD, POST-IQC, PRE-IQC, PVM, WMP Vintage 2001 Refurbished Can Inspect Contact:

ESEC 2008XP3 Bonder

• Manufacturer: ESEC
• Model: 2008 xP3

ESEC 2008XP3 Bonder We have 6 sets of ESEC 2008XP3 Bonder 's for sale in Asia. They are now in storage. 8" and 12" tables available. No Missing. Working condition before deinstall. No facility to power on so sell...

Esec 2008XP x2set Die Attach

• Manufacturer: ESEC
• Model: 2008 xP

wafer size setup : 8inch package : IC package setup Input : stack leadframe output : magazine Dispensing : PD vintage :2000 location : Asia condition : power up

ESEC 2008 HS3 PLUS

• Manufacturer: ESEC
• Model: 2008 HS3 Plus

ESEC 2008 HS3 PLUS 6 available units 12inch & 8 inch wafer table working condition Vintages 2005-2007 in Warehouse

ESEC 2008hS

• Manufacturer: ESEC
• Model: 2008

Die Bonder ESEC 2008hS refurbished to OEM spec.

ESEC 2008 The Bonder

• Manufacturer: ESEC
• Model: 2008

ESEC 2008 Die Bonder DINP, ODC/PreIQC, PostIQC, FPD, WMP

ESEC 2008hS The Bonder

• Manufacturer: ESEC
• Model: 2008

ESEC 2008hS Die Bonder TOS, EST, PSD, WMP

ESEC 2008SC The Bonder

• Manufacturer: ESEC
• Model: 2008 SC

ESEC 2008SC Die Bonder

ESEC 2008 The Bonder used semiconductor equipment

• Manufacturer: ESEC
• Model: 2008

ESEC 2008hS The Bonder used semiconductor equipment

• Manufacturer: ESEC
• Model: 2008

ESEC 2008XPIII

• Manufacturer: ESEC
• Model: 2008

Die Bonder

ESEC 2008SC The Bonder used semiconductor equipment

• Manufacturer: ESEC
• Model: 2008 SC

ESEC 2008

• Manufacturer: ESEC
• Model: 2008

ESEC 2008 Die Bonder

ESEC 2008hSplus

• Manufacturer: ESEC
• Model: 2008 HS Plus

ESEC 2008hSplus DINP, PPD, SDK, OBC, ODC, POST-IQC, WMP, RPS

ESEC 2008 XP3

• Manufacturer: ESEC
• Model: 2008 xP3

ESEC 2008 XP3 Die Bonder