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Used ESEC 2008 Die Bonders in South Korea

  • Trusted Seller
    2004 ESEC 2008xP

    2004 ESEC 2008xP

    • Manufacturer: ESEC
    • Model: 2008 xP

    De-installed, Warehoused, Can be inspected Wafer size: 300MM

    Seoul, South Korea
  • Trusted Seller
    2006 ESEC 2008hS3 plus

    2006 ESEC 2008hS3 plus

    • Manufacturer: ESEC
    • Model: 2008 HS3 Plus

    De-installed, Warehoused, Can be inspected Wafer size: 300MM

    Seoul, South Korea
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    ESEC 2008 xP Die Bonder

    • Manufacturer: ESEC
    • Model: 2008 xP

    Good condition ESEC 2008 xP Die Bonders manufactured in 2008. Located in Ireland and other countries. Click request price for more information.

    Ireland
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    ESEC 2008 HS3 Plus Die Bonder

    • Manufacturer: ESEC
    • Model: 2008 HS3 Plus

    Good condition ESEC 2008 HS3 Plus Die Bonders available between 2003 and 2008 years. Located in Malaysia and other countries. Click request price for more information.

    Malaysia