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ESEC 2008XP3
- Manufacturer: ESEC
- Model: 2008 xP3
ESEC 2008XP3 Die Bonder Ex-Works. Multiple units available. Handle up to 300mm wafer. Configuration according to customer request.
Malacca, Malaysia 
ESEC 2008 xP3 Die Bonder
- Manufacturer: ESEC
- Model: 2008 xP3
Good condition ESEC 2008 xP3 Die Bonders manufactured in 2008. Located in Ireland and other countries. Click request price for more information.
Ireland

